화학공학소재연구정보센터
학회 한국공업화학회
학술대회 2013년 봄 (05/01 ~ 05/03, ICC JEJU)
권호 17권 1호
발표분야 포스터-접착제도료잉크
제목 Flame retardancy and thermal properties of self-extinguishing epoxy composition for halogen-free semiconductor packaging materials
초록 Epoxy molding compounds are widely used as semiconductor packaging materials. Generally epoxy resin compounds contain halogen compounds as flame retardant. However, halogen compounds generate toxic substances such as dioxin derivatives that create environmental hazard. Recently Halogen-free self-extinguishing epoxy composites have been developed for epoxy molding compound (EMC) for semiconductor packaging materials. In this study, the epoxy resin composites were produced by blending the biphenylene moieties in the main chains of novolac type epoxy resin and hardener with stoichiometric reactioin ratio. DSC, PCFC, and LOI techniques were used to characterized the thermal properties and flame retardancy of the epoxy composites.
저자 이경은, 심보람, 김경만, 김영철
소속 한국화학(연)
키워드 Flame retardant; epoxy molding compound; biphenylene novolac; novolac derivative
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