화학공학소재연구정보센터
학회 한국재료학회
학술대회 2020년 가을 (11/18 ~ 11/20, 휘닉스 제주 섭지코지)
권호 26권 1호
발표분야 A. 전자/반도체 재료 분과
제목 Replacement of Copper Diffusion Barrier using Chemical Analysis of Self-Assembled Monolayer
초록 Self-assembled monolayer is organic molecule that are molecular assemblies formed spontaneously on surfaces by adsorption and are organized into more or less large ordered domain. Once this organic molecule was developed, many scientists used this molecule as replacement of other materials that were used before. Due to low thickness and various functionalities of self-assembled monolayer, this could be function as water-proof, improvement on adhesion, and etc. Here, we introduce study of functional group of self-assembled monolayer that can replace Cu diffusion barrier using chemical bonding occur in functional group. When an atom is unstable state such as missing an electron or excessing electron, it is likely to react with neighbor atom to become a stable state. Using this phenomenon, we found that functional group that is unstable state forms a bonding within themselves to become a stable state. Therefore, functional group that has strong bonding strength can prevent Cu diffusion, which can eventually lead to function as Cu diffusion barrier. Since commercial Cu diffusion barrier, TaN, is too thick to use as Cu diffusion barrier, SAM can replace its functionality. Also, depend on the bonding strength of functional group of SAMs, some SAMs have better performance as Cu diffusion barrier. Those proofs were made using X-ray Photoelectron Spectroscopy (XPS) and Time Dependent Dielectric Breakdown (TDDB) analysis. Also, the roughness of SAM was qualified using Atomic Force Microscope (AFM)
저자 Minkyu Lee, Taeyoon Lee
소속 Yonsei Univ.
키워드 <P>Self-Assembled Monolayer; chemical analysis; Diffusion barrier; Copper</P>
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