화학공학소재연구정보센터
학회 한국재료학회
학술대회 2020년 가을 (11/18 ~ 11/20, 휘닉스 제주 섭지코지)
권호 26권 1호
발표분야 B. 나노화학/바이오 재료 분과
제목 Form-Factor Free 3D Copper Circuits by Surface-Conformal Direct Printing and Laser Writing
초록 Recently, the fabrication of 3D circuits has attracted significant attention for the realization of a new-generation of printed electronics. In particular, a form-factor free Cu conductor has been recognized as the key constituent layer that can interconnect on demand a variety of active/passive components on arbitrarily designable platforms. However, even with their characteristic advantages of cost-effectiveness and high electrical conductivity, 3D printed Cu circuit has been not suggested, owing to the difficulty of suppressing undesirable oxidation reactions and the absence of appropriate strategies for transforming the 3D particulate layers into device-quality conductive ones. In this study, multidimensional particles are proposed that allow for deep penetration of incident photons in the surface-conformal laser writing process, mechanisms of which are fully clarified based on the optical simulation-based physical interpretation. The critical factors determining the electrical properties are elucidated through a spectroscopy-based investigation for 3D structured Cu conductors. It is demonstrated that 16.5 μm thick Cu features (with values of resistivity and resistance of 15 μΩ cm and 0.91 Ω cm−1, respectively) can be created simply by successive 3D printing and laser writing processes, facilitating a user-friendly design of low-cost, high performance, form-factor free electrical circuits.
저자 Yejin Jo1, Su Yeon Lee1, Sunho Jeong2, Youngmin Choi1
소속 1한국화학(연), 2경희대
키워드 3D; conformal; copper; laser; print
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