|학술대회||2020년 가을 (10/28 ~ 10/30, 광주 김대중컨벤션센터(Kimdaejung Convention Center))|
|제목||Optimization of Material and Process Method for Non-Laser Lift-off Technique Development|
|초록||The production of next-generation wearable electronic devices requires the manufacture of electronic devices on flexible substrates, and in order to produce reliable electronic devices on flexible substrates, polyimide (PI), a key substrate material, must be coated on the carrier substrates, manufactured and detached through PI Lift-off technology. Currently, Lift-off technology is mainly made up of Laser Lift-off (LLO), which uses excimer laser, but expensive consumable parts require a lot of maintenance and repair. In addition, it is hard to make a large area in principle because it uses the line scan method.
In this study, the lift-off technique of the area scan method using the xenon flash lamp and the Light to heat conversion layer (LTHC) without the using excimer laser, and a study to establish PI materials and spin coating process conditions for optimal lift-off process efficiency were investigated.
|저자||이상일, 한영준, 이준엽, 김도엽, 장성현, 최준, 조관현|
|키워드||Lift-off; polyimide; LTHC; flexible display|