화학공학소재연구정보센터
학회 한국공업화학회
학술대회 2019년 가을 (10/30 ~ 11/01, 제주국제컨벤션센터(ICC JEJU))
권호 23권 2호
발표분야 포스터_디스플레이
제목 Introduction of BN Particles to Improve the Thermal Peeling Properties of Acrylic Pressure Sensitive Adhesive
초록 Boron nitride (BN) has a hexagonal structure and exhibits excellent thermal stability, electrical insulation, chemical stability and high heat dissipation characteristics. When used as a heat dissipation filler, BN particles contact each other in a polymer to form a heat dissipation path. Since heat is diffused through the thus formed path, heat dissipation characteristics are improved. In this study, we introduced BN particles as filler to improve the thermal peeling properties of acrylic pressure sensitive adhesives. The BN particles were added by 0.1~5wt%, fabricated acrylic PSAs were characterized by FT-IR, TGA, SEM and peel tester (rt, 150˚C). As a result, it was confirmed that when the BN was added by 5wt% or more, the heat-peeling property was improved by about 10%.
저자 석웅철, 김우진, 박성원, 임종태, 강주희, 이상국, 송호준
소속 한국생산기술(연)
키워드 Heat-peelabling; acrylic PSAs; boron nitride
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