||Boron nitride (BN) has a hexagonal structure and exhibits excellent thermal stability, electrical insulation, chemical stability and high heat dissipation characteristics. When used as a heat dissipation filler, BN particles contact each other in a polymer to form a heat dissipation path. Since heat is diffused through the thus formed path, heat dissipation characteristics are improved. In this study, we introduced BN particles as filler to improve the thermal peeling properties of acrylic pressure sensitive adhesives. The BN particles were added by 0.1~5wt%, fabricated acrylic PSAs were characterized by FT-IR, TGA, SEM and peel tester (rt, 150˚C). As a result, it was confirmed that when the BN was added by 5wt% or more, the heat-peeling property was improved by about 10%.