화학공학소재연구정보센터
학회 한국공업화학회
학술대회 2019년 봄 (05/01 ~ 05/03, 부산 벡스코(BEXCO))
권호 23권 1호
발표분야 디스플레이_포스터
제목 A Novel Diamine Curing Agent with Mesogen Side Group as for Improved Thermally Conductive Composites
초록 Recently developments in thermal dissipation have heightened the need for advanced polymeric thermal conductive composite with inexpensive, easy handling, prominent workability and outstanding mechanical properties. A major problem with polymers in thermal dissipation is a low thermal conductivity in the range of 0.10-0.25 W m-1K-1. In this work, we report a novel technique to improve the thermal conductivities of boron nitride(BN)-incorporated epoxy resin composites for superior insulating thermally conductive composites. We successfully synthesized a novel kind of curing agent, diamine with mesogen side group via esterification reaction. We prepared four kinds of mixtures by adding each hydroxyl h-BN fabricated via a facile hot-press process. We investigate the thermal properties of new diamine as curing agent for improved thermally conductive composites.
저자 강주희, 박성원, 임종태, 석웅철, 권세진, 송호준, 이상국
소속 한국생산기술(연)
키워드 epoxy resin; Boron nitride; Thermal conductivity
E-Mail