화학공학소재연구정보센터
학회 한국재료학회
학술대회 2017년 봄 (05/17 ~ 05/19, 목포 현대호텔)
권호 23권 1호
발표분야 D. 구조 재료 분과
제목 Thermal properties of boron nitride nanoplatelets/epoxy nanocomposites
초록 Two-dimensional hexagonal boron nitride (h-BN) has excellent and useful mechanical and thermal properties, and can be used as a novel filler to enhance the thermal conductivity of polymer composites. We prepared exfoliated h-BN nanoplatelets (BNNPs) with hydroxyl functional groups using a hydroxide-assisted ball milling process, and demonstrated the enhanced thermal conductivity of its epoxy nanocomposites. The prepared BNNPs are highly soluble and retain their in-plane structure. The dielectric constant, and dielectric loss of the nanocomposites increases with the addition of BNNPs. Notably, the thermal conductivity of the epoxy nanocomposites with 10% mass fraction of BNNP was 0.57 W/m·K, which is 2.85 times higher than that of neat epoxy. This enhanced performance is ascribed to the high quality and dispersion of the BNNPs and their strong interfacial bonding with the epoxy matrix, produced by the hydroxyl functional groups on the BNNPs. The overall results suggest that the BNNP/epoxy nanocomposite have strong potential for application as electronic packaging materials.
저자 이동주, 박진주, 이민구, 이창규
소속 한국원자력(연)
키워드 Boron Nitride Nanoplatelet; Epoxy; Nanocomposite; Thermal Property
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