화학공학소재연구정보센터
학회 한국재료학회
학술대회 2014년 가을 (11/27 ~ 11/28, 대전컨벤션센터)
권호 20권 2호
발표분야 A. 전자/반도체 재료(Electronic and Semiconductor Materials)
제목 Heterogeneous Integrated System Technology for Internet of Things
초록 The Internet of Things (IoT) is the interconnection of uniquely identifiable objects within the existing wireless internet infrastructure. Typically, IoT is expected to offer advanced connectivity of devices, systems, and services that goes beyond people to people, people to machine, and machine-to-machine communications. The variety of “Things” integrating their intended usage functions with additional sensors, actuators, and embedded systems will open the door for “big data” in “the cloud”, i.e. collections of data sets and exploration of their uses for smart management or efficiency improvement. While the silicon system-on-a-chip (SOC) has enabled mobile information exchange platforms with a big success, many modes of sensing and actuation are still left out of the revolution, resistant so far to non-silicon microfabrication or to heterogeneous integration.  In this paper, we will explore non-silicon materials for developing a heterogeneous integrated system technology (HIST) that will be capable of detecting, analyzing, and communicating a still wider variety of stimuli, such as chemicals in the air, circulating tumor cells in the blood, micro-damage in structures, etc.  This HIST will be the set of new designs, processes and materials that allow integration of many smart functional layers (laminates) each with patterning or structures unique to its functions. The laminate may still be used as a printed circuit board or packaging substrate, which offers the benefit of allowing pre-packaged electronics/sensors/actuators to be built without the need to increase package footprint area. HIST can enable and accommodate both existing nanomaterials that have not been applied in practice and proven macro technologies that have not yet been miniaturized.  We will illustrate HIST manufacturing processes allowing for a broader selection of functional materials and fabrication processes than silicon-based manufacturing. A variety of affordable, scalable, accessible, and portable (ASAP) integrated systems for IoT will also be presented.
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