Journal of Polymer Science Part B: Polymer Physics, Vol.45, No.13, 1662-1674, 2007
Effect of AlN content on the performance of brominated epoxy resin for printed circuit board substrate
Polymer matrix composites, based on brominated epoxy, a type of material widely used in printed circuit boards (PCBs), as matrix and AlN particle as filler were prepared. The influences of AIN content on the mechanical, thermal, and electrical properties of the composites were investigated by uniaxial tensile test, TMA, thermal conductivity measurement, DMA, and dielectric properties measurement. It was found that the properties of composites monotonically varied with AIN content except that maximum tensile strength and strain of composites corresponded to a filler content of 10 wt %. The results of DMA also showed the AIN reinforcement was more pronounced above T-g and the peak area of tan delta versus T curves decreased with AIN content, which implied the damping capacity of the composite gradually decreased. The increase in T-g and decrease in damping were probably due to strong interaction between the AIN and epoxy matrix inhibiting the mobility of the epoxy chain. In addition, different theoretical models reported in the literature were used to predict the E, CTE, k, and D-k, and compared with the experimental data. Finally, suitable models were recommended in the present materials system. For the significant improvement of performance of epoxy, we can conclude that these composite materials may be promising for PCB substrate. (c) 2007 Wiley Periodicals, Inc.
Keywords:AlN additives;brominated epoxy;coefficient of thermal expansion;dielectric constant;dielectric dissipation factor;dynamic mechanical analysis;glass-transition temperature;halogenated resins;tensile strength;theoretical models;thermal conductivity;Young's modulus