Applied Surface Science, Vol.165, No.4, 249-254, 2000
Electroplating of copper films on steel substrates from acidic gluconate baths
Electroplating of thin films of copper onto steel substrate from acidic gluconate bath has been investigated under different conditions of bath composition, pH, current density, and temperature. A detailed study has been made about the effect of these parameters on potentiodynamic cathodic polarization, cathodic current efficiency (CCE%), and throwing power (TP) of the bath. Fine grained, highly adherent and smooth bright deposits were produced. X-ray diffraction analysis showed that these deposits were produced in one phase with crystalline cubic structure. The optimum conditions are: 10 g l(-1) CuSO4. 5H(2)O, 30 g l(-1) C6H11O7Na, 10 g l(-1) K2SO4, pH = 2.2, 1I= 2.8 mA cm(-2), and temperature range between 22 degrees C and 31 degrees C. The TP of the bath is greatly improved by increasing the current density.