화학공학소재연구정보센터
Macromolecular Research, Vol.13, No.1, 8-13, February, 2005
Synthesis and Characterization of a Novel Silicon-Containing Epoxy Resin
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A novel silicon-containing epoxy resin, the diglycidylether of bisphenol A-silicon (DGEBA-Si), was synthesized and characterized. The properties of the DGEBA-Si epoxy resin cured with 4,4-diaminodiphenyl methane (DDM), including its cure behavior, glass transition temperature, thermal stability, and mechanical strength were investigated. The char yield of the DGEBA-Si/DDM system was higher than that of a commercial DGEBA/DDM system, indicating that the DGEBA-Si epoxy resin showed good flame-retardance. The cured DGEBA-Si/DDM specimens possessed lower glass transition temperatures and higher mechanical properties than DGEBA/DDM specimens. These features were attributed to the introduction of siloxane groups into the main chain of the epoxy resin, which resulted in the improved flexibility of the cured DGEBA-Si/DDM system.