화학공학소재연구정보센터
Thin Solid Films, Vol.280, No.1-2, 136-141, 1996
Grain-Size and Strain in Thin Sputter-Deposited Ni0.8Fe0.2 and Cu Films
The average grain size and strain in the direction parallel to the surface of thin Ni0.8Fe0.2 and Cu films, sandwiched between Ta layers, have been determined as a function of layer thickness by grazing incidence X-ray diffraction. The in-plane grain size and grain size distribution were also assessed by plan-view transmission electron microscopy. Standard theta-2 theta X-ray powder diffraction was used to determine the uniform strain in the direction perpendicular to the surface. Both for Ni0.8Fe0.2 and Cu, an elongation of the lattice parameter perpendicular to the surface and a compression of the lattice parameter in the plane of the film is observed, which decreases with increasing film thickness. Additionally, for Ni0.8Fe0.2 a non-uniform elongation of the perpendicular interatomic distance at the Ta interfaces is deduced by fitting a kinematical model to the theta-2 theta diffraction spectrum. This study illustrates the strength and the complementary character of standard powder X-ray diffraction, grazing incidence X-ray diffraction and transmission electron microscopy for the structural analysis of thin metal films.