In the harsh environment, the corrosion of Cu leads to the failure of pipelines, condenser, printed circuit board and so forth. Thus, protecting Cu from corrosion is critically important from both science and engineering backgrounds. In this report, the hierarchical structure compositing dendritic Cu and ZIF-67 is prepared onto Cu by a two-step electrodeposition protocol. After thiol modification and oil infusion, bioinspired superhydrophobic surface (SHS) and slippery liquid-infused porous surface (SLIPS) is respectively achieved, and sophisticated techniques are used for characterizing chemical composition, morphology, topology and wettability. Scanning Kelvin probe is employed to know the surface potential distribution before and after the biomimetic transformation. Using different electrochemical approaches, the corrosion inhibition effect is elucidated. In 3.5 wt% NaCl corrosive medium, |Z|0.01Hz of SLIPS is as high as 1.35 × 108 Ω∙cm2 at the initial immersion stage. The value is remarkably enhanced compared with SHS (6.76 × 104 Ω∙cm2) and bare Cu (8.74 × 103 Ω∙cm2). After soaking for 168 h, |Z|0.01Hz value of SHS and SLIPS is 3.84 × 104 Ω∙cm2 and 4.93 × 106 Ω∙cm2, illustrating that SLIPS has high resistance to protect Cu from corrosion.