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Journal of the Electrochemical Society, Vol.166, No.12, D505-D507, 2019
Communication-Bottom-Up TSV Filling Using Sulfonated Diallyl Dimethyl Ammonium Bromide Copolymer as a Leveler
A new leveler, sulfonated diallyl dimethyl ammonium bromide copolymer, exhibits the void-free through silicon via (TSV) bottom-up filling with 5 minutes. The leveler has been characterized by CVS measurements with different concentrations at different RDE rotation speeds. The results show that SDDABC assisted the formation of a strong inhibition layer on copper surface when 16 ppm concentration has been added. Furthermore, bottom-up TSV filling with nearly no deposit on TSV sidewall is achieved with 16 ppm of SDDABC. Also, the filling time of 20 x 45 mu m TSV is only 5 minutes. (C) 2019 The Electrochemical Society.