화학공학소재연구정보센터
Korean Journal of Materials Research, Vol.15, No.7, 465-472, July, 2005
연속 ECR-CVD 조업하에 RF-magnetron-sputter의 싸이클조업을 통해 PET위에 올려진 구리박막의 특성
Characteristic of Copper Films on PET Substrate Deposited by Cyclic Operation of RF-magnetron-sputtering Coupled with Continuous Operation of ECR-CVD
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Preparation of copper film on PET substrate was carried out by cyclic operation of RF-magnetron­sputtering under continuous operation of ECR-CVD. The purpose of this study is aimed to an increase in deposition rate with keeping excellent adhesion between copper film and PET. In order to optimize the sputtering time under continuous ECR-CVD, cyclic operation concept is employed. By changing parameters of cyclic operation such as split of e and cycle time of A, the characteristics and thickness of the deposited copper film are controlled. As [Math Processing Error] value increase, film thickness could confirm to increase and its surface resistivity value decreases. The highest adhesive strength appears at [Math Processing Error] and cycle time of 30 min. The uniformity of copper film shows [Math Processing Error] in our experimental range.
  1. Lim TH, Huh YJ, Park TJ, HWAHAK KONGHAK, 32(3), 332 (1994)
  2. Kurdi J, Ardelean H, Marcus P, Jonnard P, Arefi-Khonsari F, Appl. Surf. Sci., 189(1-2), 119 (2002)
  3. Silvain JF, Ehrhardt JJ, 236, 230 (1993) (1993)
  4. Cueff R, Baud G, Benmalek M, Besse JP, Butruille JR, Dunlop HM, Jacquet M, Thin Solid Films, 270(1-2), 230 (1995)
  5. Paligova M, Vilkacova J, Saha P, Kresalek V, Stejskal J, Quadrat O, Pysica. A, 335, 421 (2004)
  6. Park I, KAIST Ph.D. dissertation, 1991, pp. 1-2 (1991)
  7. Lim VWL, Kang ET, Neoh KG, Synthetic Metals, 123, 107 (2001)
  8. Lugscheider E, Bobzin K, Maes M, Kramer A, Thin Solid Films, 459(1-2), 313 (2004)
  9. Martin L, Esteve J, Boross S, Thin Solid Films, 451-452, 74 (2004)
  10. Kim S, Park JM, Choi DJ, Thin Solid Films, 320(1), 95 (1998)
  11. Gu S, Atanasova P, Hampden-Smith MJ, Kodas TT, 340, 45 (1999) (1999)
  12. Outten CA, Barbour JC, Wampler WR, J. Vac. Sci. Technol. A, 9(3), 717 (1991)
  13. Matsuo S, Kiuchi M, Jpn. J. Appl. Phys., 22(4), L210 (1983)
  14. Asmussen J : 'Hand book of plasma processing technology', Rossnagel SM, Cuomo JJ, Westwood WD.(ed.), Noyes Publication, Park Ridge (New Jergy), 1990 p.285 (1990)
  15. Matsuo S: 'Handbook of Thin film Deposition Processes and techniques', Schuegraft(ed.) K Noyes Publication, Park Ridge, New Jergy, 1988, p.147 (1988)
  16. Oehr C, Suhr H, Appl. phys. A, 45, 151 (1998)
  17. Kodas TT, Hamden-smith MJ, J. of Organometallic Chemistry, 522, 161 (1996)
  18. Lim JW, Mimura K, Isshiki M, Appl. Surf. Sci., 217(1-4), 95 (2003)
  19. Fujinami Y, Hayashi H, Ebe A, Imai O, Ogata KI, Mat. Chem. Phys., 54, 102 (1998)