Previous Article Next Article Table of Contents Polymer Science and Technology, Vol.26, No.1, 40-46, February, 2015 Full-Text PDF Export Citation [일반총설] 반도체 패키징 공정용 Debonding 기술 및 접착소재의 응용 Debonding Technologies and Application of Adhesive for Semiconductor Packaging Process 이승우, 박초희, 박지원, 임동혁, 송준엽, 이재학, 김승만, 김현중 Please enable JavaScript to view the comments powered by Disqus.
