Journal of Adhesion Science and Technology, Vol.27, No.14, 1525-1534, 2013
Residual thermal stress analysis of SiC joint by polysiloxane silicon resin YR3187
Reaction-bonded silicon carbide was joined using a polysiloxane silicon resin YR3187. Residual thermal stress distribution in joint structure was calculated by finite element analysis method. Factors influencing the distribution of residual thermal stress, including joining temperature, thickness of join layer, and presence of crack in join layer, were studied. The simulated results were compared with actual joint strength. It is showed that in determining the joining temperature, the pyrolysis procedure of silicon resin should be taken into consideration; in addition, the reasonable thickness of the join layer and the reduction of cracks in join layer are important to obtain higher joint strength.