화학공학소재연구정보센터
Macromolecular Research, Vol.21, No.8, 916-920, August, 2013
Embossed superhydrophobic polymer surfaces with topological variances
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In this report, we compare hot and ultraviolet (UV) embossing processes to fabricate hydrophobic surfaces with topological variance. In the hot embossing process, polypropylene was pressurized on a nickel mold with heat, while UV-curable polyurethane acrylate (PUA) was dispensed on the mold followed by UV exposure during the UV embossing process. Cylindrical micro-pillars were successfully replicated using two types of embossing processes with the same mold. The contact angles were then compared at various pillar diameters and with different embossing processes. Although the materials and embossing techniques were different, we achieved a contact angle (CA) enhancement of about 40%. The water contact angle of a transferred substrate, fabricated by the UV embossing process, was 138°. This was much higher than that of flat UV-cured PUA (78°). In addition, we fabricated reverse pillar-shape packing materials for good wettability and then compared the CA values. With the reverse-shape model, we were able to enhance the wettability and decrease the degree of hydrophobicity. This will be beneficial for lipophilic packing materials. This oleophilic characteristic demonstrates enhanced lubrication capabilities as a retort curry packing material.
  1. Barthlott W, Neinhuis C, Planta, 202, 1 (1997)
  2. Gao X, Jiang L, Nature, 432, 36 (2004)
  3. Wenzel RN, Ind. Eng. Chem., 28, 7 (1936)
  4. Cassie ABD, Baxter S, J. Chem. Soc.-Faraday Trans., 40, 546 (1944)
  5. Tsujii K, Yamamoto T, Onda Y, Shibuichi S, Angew. Chem.-Int. Edit., 36, 1011 (1997)
  6. Cao LL, Jones AK, Sikka VK, Wu JZ, Gao D, Langmuir, 25(21), 12444 (2009)
  7. Lee SE, Lee D, Lee P, Ko SH, Lee SS, Hong SU, Macromol. Mater. Eng., DOI:10.1002/mame.201200098., 297 (2012)
  8. Nosonovsky M, Bhushan B, Nano Lett., 7, 2633 (2007)
  9. Crick CR, Parkin IP, Chem. Commun., 47, 12059 (2011)
  10. Gao XF, Yan X, Yao X, Xu L, Zhang K, Zhang JH, Yang B, Jiang L, Adv. Mater., 19(17), 2213 (2007)
  11. He M, Li H, Wang J, Song Y, Appl. Phys. Lett., 98, 093118 (2011)
  12. Chiou NR, Lui CM, Guan JJ, Lee LJ, Epstein AJ, Nat. Nanotechnol., 2(6), 354 (2007)
  13. Choi CH, Hagvallb SH, Wub BM, Dunn JCY, Beyguic RE, Kim CJ, Biomaterials, 28, 1672 (2007)
  14. Yao X, Song YL, Jiang L, Adv. Mater., 23(6), 719 (2011)
  15. Hong J, Bae WK, Lee H, Oh S, Char K, Caruso F, Cho J, Adv. Mater., 19(24), 4364 (2007)
  16. Jin MH, Feng XJ, Xi JM, Zhai J, Cho KW, Feng L, Jiang L, Macromol. Rapid Commun., 26(22), 1805 (2005)
  17. He B, Patankar NA, Lee J, Langmuir, 19(12), 4999 (2003)
  18. Choi CH, Kim CJ, Phys. Rev. Lett., 96, 066001 (2006)
  19. Lee SE, Lee KW, Kim JH, Lee KC, Lee SS, Hong SU, Chem. Commun., 47, 12005 (2011)
  20. Onda T, Shibuichi S, Satoh N, Tsujii K, Langmuir, 12(9), 2125 (1996)
  21. Shibuichi S, Onda T, Satoh N, Tsujii K, J. Phys. Chem., 100(50), 19512 (1996)
  22. Nakajima A, Abe K, Hashimoto K, Watanabe T, Thin Solid Films, 376(1-2), 140 (2000)
  23. Choi SJ, Suh KY, Lee HH, Nanotechnology, 19, 275305 (2008)
  24. Tadanaga K, Morinaga J, Minami T, J. Sol-Gel Sci. Technol., 26, 705 (2003)
  25. Kim DS, Lee BK, Yeo J, Choi MJ, Yang W, Kwon TH, Microelectron. Eng., 86, 1375 (2009)
  26. Tsujii K, Yamamoto T, Onda T, Shibuichi S, Angew. Chem.-Int. Edit., 36, 1011 (1997)
  27. Mayer P, Vaes WHJ, Hermens JLN, Anal. Chem., 72, 459 (2000)
  28. Erbil HY, Demirel AL, Avc Y, Mert O, Science, 299, 1377 (2003)
  29. Hong SH, Hwang J, Lee H, Nanotechnology, 20, 385303 (2009)
  30. Occhiello E, Morra M, Morini G, Garbassi F, Humphrey P, J. Appl. Polym. Sci., 42, 551 (1991)
  31. Kim HD, Kim TW, J. Appl. Polym. Sci., 67(13), 2153 (1998)