Thin Solid Films, Vol.516, No.11, 3493-3496, 2008
Challenges in etch: What's new?
Challenges, new and old, are outlined for etching at the 45 nm technology node and below. The over-riding challenges pertain to improving selectivity over a wider range of materials and topographies and predicting pattern density behavior to reduce cost in mask design. (C) 2007 Elsevier B.V. All rights reserved.