Journal of Adhesion Science and Technology, Vol.17, No.5, 623-632, 2003
Shock-resistant ambient temperature curing epoxy adhesive
A shock-resistant adhesive was developed by modifying the epoxy resin with a carboxyl-terminated poly(ethylene glycol) adipate (CTPEGA). CTPEGA was incorporated into the epoxy matrix by pre-reaction. CTPEGA modification showed significant enhancement in bond strength, toughness and flexibility. The optimum adhesion was obtained at 20 phr (parts per hundred parts of resin) of CTPEGA. The results are discussed in terms of tensile and dynamic mechanical properties of the modified networks. Dynamic mechanical analysis (DMA) showed higher damping (tan delta = 0.18 at ambient temperature) that indicates better shock resistance of the modified epoxy over the unmodified one.