화학공학소재연구정보센터
Journal of Adhesion, Vol.79, No.2, 105-121, 2003
Physical properties of a bisphenol-F epoxy containing a silica filler treated with silane coupling agents
A model epoxy system consisting of a diglycidyl ether of bisphenol-F epoxy resin, 1,4-butanediol, and cured with 4-methyl-2-phenylimidazole has been investigated. Thermal analysis indicated that 3 parts per hundred resin (phr) is the optimum amount of curing agent for this system. The influence of silane-treated amorphous fumed silica fillers on properties of the cured epoxy was also examined. Silica particles were treated with 3-aminopropyldiethoxymethylsilane (APDS) and 3-aminopropyltriethoxysilane (APTS) coupling agents. No change in glass transition temperatures was observed with the addition of the filler (with or without coupling agents) to the epoxy. Addition of the filler led to a slight increase in the activation energy for the glass transition; however no change in activation energy was observed when using the coupling agent. Addition of either coupling agent to the filler surface led to an increase in cooperativity. Fumed silica also did not significantly affect moisture diffusion properties, but a small decrease was observed in the moisture saturation mass with the addition of silica particles treated with APDS.