화학공학소재연구정보센터
Polymer(Korea), Vol.36, No.5, 549-554, September, 2012
HDPE/EPDM/Boron Carbide/Triphenyl Phosphate 블렌드의 상용화제 첨가에 따른 난연성 및 기계적 물성 연구
A Study on Flammability and Mechanical Properties of HDPE/EPDM/Boron Carbide/Triphenyl Phosphate Blends with Compatibilizer
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초록
난연제 triphenyl phosphate는 HDPE(high-density polyethylene)/EPDM(ethylene-propylene diene monomer)/boron carbide 내에서 miscibility가 좋지 못하여 고분자의 기계적 물성을 크게 저하시킨다. HDPE/EPDM/boron carbide/triphenyl phosphate 블렌드의 분산성을 향상시키기 위해서 상용화제로 PE-g-MAH(polyethylene-graft-maleic anhydride)를 사용하여 블렌딩하였다. Triphenyl phosphate 함량이 증가할수록 인장강도를 크게 저하시킴을 확인하였다. 하지만 상용화제 첨가로 인하여 기계적 물성이 향상되는 것을 확인하였다. Triphenyl phosphate의 분산성의 향상은 SEM 분석을 통해서 확인하였다. HDPE/EPDM/boron carbide/triphenyl phosphate의 내열성과 난연성을 측정하기 위해서 TGA 분석과 LOI 분석을 진행하였다. 분산성이 향상됨에 따라서 triphenyl phosphate 첨가제의 기본적인 특성인 내열성과 난연성이 향상되었으며, 그 결과로 자기 소화성인 21% 이상의 한계산소지수(LOI)를 가지는 HDPE/EPDM/boron carbide/triphenyl phosphate 블렌드를 얻을 수 있었다.
It was known that triphenyl phosphate wasn’t homogeneously dispersed in HDPE/EPDM/boron carbide blends, which caused the decrease in mechanical properties. HDPE, EPDM, boron carbide, and triphenyl phosphate were blended with PE-g-MAH(polyethylene-graft-maleic anhydride) as a compatiblizer for improving the miscibility of triphenyl phosphate. Tensile strength of HDPE/EPDM/boron carbide blends decreased with increasing the contents of triphenyl phosphate for flammability. However, the mechanical properties of HDPE/EPDM/boron carbide/triphenyl phosphate blends increased by the addition of compatiblizer because triphenyl phosphate was homogeneously mixed in the blend system. The homogeneous dispersibility of triphenyl phosphate was confirmed by using scanning electron microscopy (SEM). Increased thermal stability and flammability derived from high miscibility of triphenyl phosphate were confirmed by the results of thermogravimetric analysis (TGA) and limiting oxygen index (LOI). A self-extinguishing HDPE/EPDM/boron carbide/triphenyl phosphate blend was successfully fabricated with more than 21% LOI.
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