화학공학소재연구정보센터

Journal of the Electrochemical Society

Journal of the Electrochemical Society, Vol.166, No.1 Entire volume, number list
ISSN: 0013-4651 (Print) 

In this Issue (34 articles)

Y1 - Y1 Preface-Advances in Electrochemical Processes for Interconnect Fabrication in Integrated Circuits
Akolkar R, Broekmann P
D3001 - D3005 Deposition of Copper Nanofilms by Surface-Limited Redox Replacement of Underpotentially Deposited Lead on Polycrystalline Gold
Dornhof J, Urban GA, Kieninger J
D3006 - D3012 Effect of Reverse Pulse on Additives Adsorption and Copper Filling for Through Silicon Via
Zhu QS, Zhang X, Liu CZ, Liu HY
D3013 - D3021 Pb Monolayer Mediated Thin Film Growth of Cu and Co: Exploring Different Concepts
Wu D, Solanki DJ, Joi A, Dordi Y, Dole N, Litvnov D, Brankovic SR
D3022 - D3034 Bottom-up Filling of Damascene Trenches with Gold in a Sulfite Electrolyte
Josell D, Moffat TP
D3035 - D3041 Aluminum Electrochemical Nucleation and Growth onto a Glassy Carbon Electrode from a Deep Eutectic Solvent
Rodriguez-Clemente E, Manh TL, Guinto-Pano CE, Romero-Romo M, Mejia-Caballero I, Morales-Gil P, Palacios-Gonzalez E, Ramirez-Silva MT, Palomar-Pardave M
D3042 - D3048 Modeling of the Coadsorption of Chloride and Hydrogen Ions on Copper Electrode Surface
Yang HL, Dianat A, Bobeth M, Cuniberti G
D3049 - D3057 Review-In-Situ Surface X-ray Diffraction Studies of Copper Electrodes: Atomic-Scale Interface Structure and Growth Behavior
Grunder Y, Stettner J, Magnussen OM
D3058 - D3065 Observation of the Behavior of Additives in Copper Electroplating Using a Microfluidic Device
Akita T, Tomie M, Ikuta R, Egoshi H, Hayase M
D3066 - D3071 Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology
Menk LA, Josell D, Moffat TP, Baca E, Blain MG, Smith A, Dominguez J, McClain J, Yeh PD, Hollowell AE
D3072 - D3096 Review-Management of Copper Damascene Plating
Carpio R, Jaworski A
D3097 - D3099 Communication-Electrodeposition of Nano-Twinned Cu in Void-Free Filling for Blind Microvia of High Density Interconnect
Zhu QS, Zhang X, Li SJ, Liu CZ, Li CF
D3100 - D3109 Annealing and Impurity Effects in Co Thin Films for MOL Contact and BEOL Metallization
Kelly J, Kamineni V, Lin X, Pacquette A, Hopstaken M, Liang Y, Amanapu H, Peethala B, Jiang L, Demarest J, Shobha H, Raymond M, Haran B
D3110 - D3119 Aspects and Modeling of Oscillatory Acid Copper Electroplating
Haubner K, Fischer T, Brunner H, Pohlmann L, Donner C
D3120 - D3128 NTBC and MTT Reduction Electrochemistry: Impact on Cu Superconformal Plating for Fabrication of Glass Interposers
Li JX, Dimitrov N
D3129 - D3135 Differential Inhibition during Cu Electrodeposition on Ru: Combined Electrochemical and Real-Time TEM Studies
Vereecken PM, Radisic A, Ross FM
D3136 - D3141 Mechanism of Cobalt Bottom-Up Filling for Advanced Node Interconnect Metallization
Wu J, Wafula F, Branagan S, Suzuki H, van Eisden J
D3142 - D3154 Pulsed Galvanostatic Electrodeposition of Copper on Cobalt Using a pH-Neutral Plating Bath and Electroless Seeds
Simpson DE, Johnson CA, Roy D
D3155 - D3157 Communication-Defect-Free Filling of High Aspect Ratio Through Vias in Ultrathin Glass
Chang YH, Tseng PL, Lin JC, Chen JC, Huang MC, Lin HY, Pollard S, Mazumder P
D3158 - D3166 Epitaxial Bonding and Transfer Processes for Large-Scale Heterogeneously Integrated Electronic-Photonic Circuitry
Carlson JA, Williams CG, Ganjoo M, Dallesasse JM
D3167 - D3174 The Critical Role of pH Gradient Formation in Driving Superconformal Cobalt Deposition
Rigsby MA, Brogan LJ, Doubina NV, Liu YH, Opocensky EC, Spurlin TA, Zhou J, Reid JD
D3175 - D3181 Effects of Dimethylglyoxime and Cyclohexane Dioxime on the Electrochemical Nucleation and Growth of Cobalt
Hu Y, Huang Q
D3182 - D3189 Modeling of Dendrite Formation as a Consequence of Diffusion-Limited Electrodeposition
Lupo C, Schlettwein D
D3190 - D3199 Review-Laser Ablation Ionization Mass Spectrometry (LIMS) for Analysis of Electrodeposited Cu Interconnects
Grimaudo V, Moreno-Garcia P, Riedo A, Lopez AC, Tulej M, Wiesendanger R, Wurz P, Broekmann P
D3200 - D3204 High-Resolution Nanoprinting Approach through Self-Driven Electrodeposition
Feng ZG, Xie YY, Georgescu NS
D3205 - D3211 Palladium Nanoparticles Electrodeposition onto Glassy Carbon from a Deep Eutectic Solvent at 298 K and Their Catalytic Performance toward Formic Acid Oxidation
Espino-Lopez IE, Romero-Romo M, de Oca-Yemha MGM, Morales-Gil P, Ramirez-Silva MT, Mostany J, Palomar-Pardave M
D3212 - D3218 The Effects of Plating Current, Grain Size, and Electrolyte on Stress Evolution in Electrodeposited Ni
Rao Z, Hearne SJ, Chason E
D3219 - D3225 Review-Ruthenium as Diffusion Barrier Layer in Electronic Interconnects: Current Literature with a Focus on Electrochemical Deposition Methods
Bernasconi R, Magagnin L
D3226 - D3231 Galvanostatic Plating with a Single Additive Electrolyte for Bottom-Up Filling of Copper in Mesoscale TSVs
Menk LA, Baca E, Blain MG, McClain J, Dominguez J, Smith A, Hollowell AE
D3232 - D3237 Influence of Current Density on Orientation-Controllable Growth and Characteristics of Electrochemically Deposited Au Films
Liu LT, Zhu XL, Wei SH, Zhang J, Baklanov MR, Fanta ABD, Niu JB, Xie CQ
D3238 - D3245 Thermal Expansion and Thermal Stress Behavior of Electroless-Plated Fe-Ni-B Alloy Thin Film for High-Density Packaging
Yamamoto T, Nagayama T, Nakamura T
D3246 - D3253 In-Situ Stress Measurements during Cobalt Electrodeposition
Graciano VP, Bertocci U, Stafford GR
D3254 - D3258 Bottom-Up Copper Filling of Millimeter Size Through Silicon Vias
Josell D, Menk LA, Hollowell AE, Blain M, Moffat TP
D3259 - D3271 Effect of Chloride Concentration on Copper Deposition in Through Silicon Vias
Braun TM, Josell D, Silva M, Kildon J, Moffat TP