141 - 151 |
Development of a new thermoplastic laminate system Kumar G, Ramani K, Xu CC |
153 - 167 |
Adhesion improvement of thermoplastic-based isotropic conductive adhesives under humid environment using self-assembled monolayer compounds Moon KS, Rockett C, Wong CP |
169 - 179 |
Synthesis and characterisation of polyurethanes derived from waste black liquor lignin Chahar S, Dastidar MG, Choudhary V, Sharma DK |
181 - 193 |
Studies on the adhesive properties of neoprene-phenolic blends Varghese LA, Thachil ET |
195 - 203 |
Functionalized low-density polyethylene via a novel photografting method and its adhesion properties Gao J, Lei JX, Li QM, Ye SY |
205 - 211 |
Characterization of epoxy resin hardening with ketimine latent hardeners Okuhira H, Kii T, Ochi M, Takeyama H |
213 - 225 |
Hygienic assessment of polymeric coatings by physico-chemical and microbiological approaches Boulange-Petermann L, Robine E, Ritoux S, Cromieres B |
227 - 242 |
Fracture mechanics approach to predict delamination lifetime in Mode II under constant loads Al-Khanbashi A, Hamdy AE |
243 - 259 |
Spatially resolved wettability control of polymer surfaces using laser-detonated hyperthermal atomic beams Tagawa M, Ohki Y, Yokota K, Ohmae N |
261 - 273 |
Enzymatically-modified soy protein part 2: adhesion behaviour Kumar R, Choudhary V, Mishra S, Varma IK |
275 - 285 |
Adhesion between an underfill and the passivation layer in flip-chip packaging Luo SJ, Wong CP |