화학공학소재연구정보센터
검색결과 : 117건
No. Article
81 Electrodeposition of Cu from acidic sulphate solutions in the presence of PEG: An electrochemical and spectroelectrochemical investigation -Part I
Bozzini B, Mele C, D'Urzo L, Giovannelli G, Natali S
Journal of Applied Electrochemistry, 36(7), 789, 2006
82 An electrochemical and in situ SERS study of Cu electrodeposition from acidic sulphate solutions in the presence of 3-diethylamino-7-(4-dimethylaminophenylazo)-5-phenylphenazinium chloride (Janus Green B)
Bozzini B, Mele C, D'urzo L, Romanello V
Journal of Applied Electrochemistry, 36(9), 973, 2006
83 Magnetoresistive granular Cu-Co-Ni coatings prepared by electrodeposition
Pane S, Gomez E, Valles E
Journal of Electroanalytical Chemistry, 596(2), 87, 2006
84 Hydrodynamic effects on the performance of an electrochemical reactor for destruction of copper cyanide. Part 2 - reactor kinetics and current efficiencies
Szpyrkowicz L, Kelsall GH, Souto RM, Ricci F, Kaul SN
Chemical Engineering Science, 60(2), 535, 2005
85 Comparative study of copper electrodeposition from sulphate acidic electrolytes in the presence of IT-85 and of its components
Varvara S, Muresan L, Popescu IC, Maurin G
Journal of Applied Electrochemistry, 35(1), 69, 2005
86 Coupled mesoscale - Continuum simulations of copper electrodeposition in a trench
Drews TO, Webb EG, Ma DL, Alameda J, Braatz RD, Alkire RC
AIChE Journal, 50(1), 226, 2004
87 Periodic structures of randomly distributed Cu/Cu2O nanograins and periodic variations of cell voltage in copper electrodeposition
Zhang MZ, Wang M, Zhang Z, Zhu JM, Peng RW, Ming NB
Electrochimica Acta, 49(14), 2379, 2004
88 Development of a bath for codeposition of copper and platinum
Obert J, Lalvani SB
Journal of Applied Electrochemistry, 34(4), 397, 2004
89 Electrochemical surface modification of aluminium sheets for application to nano-electronic devices: Anodization aluminium and electrodeposition of cobalt-copper
Ohgai T, Hoffer X, Gravier L, Ansermet JP
Journal of Applied Electrochemistry, 34(10), 1007, 2004
90 X-ray diffraction investigation of electrochemically deposited copper
Pantleon K, Jensen JD, Somers MAJ
Materials Science Forum, 443-4, 201, 2004