81 |
Effect of Doping Concentration on Microstructure of Conjugated Polymers and Characteristics in N-Type Polymer Field-Effect Transistors Liu C, Jang J, Xu Y, Kim HJ, Khim D, Park WT, Noh YY, Kim JJ Advanced Functional Materials, 25(5), 758, 2015 |
82 |
A Three Component Self-Assembled Epitaxial Nanocomposite Thin Film Kim DH, Sun XY, Aimon NM, Kim JJ, Campion MJ, Tuller HL, Kornblum L, Walker FJ, Ahn CH, Ross CA Advanced Functional Materials, 25(20), 3091, 2015 |
83 |
Self-Assembled, Millimeter-Sized TIPS-Pentacene Spherulites Grown on Partially Crosslinked Polymer Gate Dielectric Yoo H, Choi HH, Shin TJ, Rim T, Cho K, Jung S, Kim JJ Advanced Functional Materials, 25(24), 3658, 2015 |
84 |
Investigation of Cu growth phenomena on Ru substrate during electroless deposition using hydrazine as a reducing agent Kim KH, Lim T, Park KJ, Koo HC, Kim MJ, Kim JJ Electrochimica Acta, 151, 249, 2015 |
85 |
Galvanostatic bottom-up filling of TSV-like trenches: Choline-based leveler containing two quaternary ammoniums Kim MJ, Seo Y, Kim HC, Lee Y, Choe S, Kim YG, Cho SK, Kim JJ Electrochimica Acta, 163, 174, 2015 |
86 |
A Multiple Interaction Analysis Reveals ADRB3 as a Potential Candidate for Gallbladder Cancer Predisposition via a Complex Interaction with Other Candidate Gene Variations Rai R, Kim JJ, Misra S, Kumar A, Mittal B International Journal of Molecular Sciences, 16(12), 28038, 2015 |
87 |
Investigation of nanoporous platinum thin films fabricated by reactive sputtering: Application as micro-SOFC electrode Jung W, Kim JJ, Tuller HL Journal of Power Sources, 275, 860, 2015 |
88 |
Promising efficiency enhancement in cobalt redox couple-based back-illuminated dye-sensitized solar cells with titanium foil substrate Kim M, Yun HG, Jang LW, Jeon DW, Kang MG, Yoon JH, Kim JM, Park JH, Lee IH, Kim JJ Journal of Power Sources, 278, 32, 2015 |
89 |
Bottom-up Filling of through Silicon Vias Using Galvanostatic Cu Electrodeposition with the Modified Organic Additives Kim HC, Choe S, Cho JY, Lee D, Jung I, Cho WS, Kim MJ, Kim JJ Journal of the Electrochemical Society, 162(3), D109, 2015 |
90 |
Accuracy Improvement in Cyclic Voltammetry Stripping Analysis of Thiourea Concentration in Copper Plating Baths Choe S, Kim MJ, Kim KH, Kim HC, Song JC, Kim SK, Kim JJ Journal of the Electrochemical Society, 162(4), H294, 2015 |