화학공학소재연구정보센터
검색결과 : 98건
No. Article
81 유동층 CO2 회수공정을 위한 흡수제의 흡수 및 재생특성
이창근, 홍선욱, 조성호, 손재익, 최정후
Korean Chemical Engineering Research, 43(2), 294, 2005
82 Drug Release Behavior of Poly( ε-caprolactone)-b-Poly(acrylic acid) Shell Crosslinked Micelles below the Critical Micelle Concentration
Hong SW, Kim KH, Huh J, Ahn CH, Jo WH
Macromolecular Research, 13(5), 397, 2005
83 Human apolipoprotein(a) kringle V inhibits angiogenesis in vitro and in vivo by interfering with the activation of focal adhesion kinases
Kim JS, Yu HK, Ahn JH, Lee HJ, Hong SW, Jung KH, Chang SI, Hong YK, Joe YA, Byun SM, Lee SK, Chung SI, Yoon Y
Biochemical and Biophysical Research Communications, 313(3), 534, 2004
84 Anti-complement Effects of Anion-Substituted Poly(vinyl alcohol) Membranes
Ryu KE, Rhim H, Park CW, Chun HJ, Hong SW, Kim YC, Lee YM
Macromolecular Research, 12(1), 46, 2004
85 Reversibility of established diabetic glomerulopathy by anti-TGF-beta antibodies in dbldb mice
Chen S, Igleasias-de la Cruz MC, Jim B, Hong SW, Isono M, Ziyadeh FN
Biochemical and Biophysical Research Communications, 300(1), 16, 2003
86 The effect of NH3 plasma treatment on the electroless copper deposition on TaNx (x=0=1) diffusion barriers
Hong SW, Lee YS, Park JW
Electrochemical and Solid State Letters, 6(1), C12, 2003
87 C-2-symmetric bis(oxazolinato)lanthanide catalysts for enantioselective intramolecular hydroamination/cyclization
Hong SW, Tian S, Metz MV, Marks TJ
Journal of the American Chemical Society, 125(48), 14768, 2003
88 Nucleation and growth of electroless palladium deposition on polycrystalline TiN barrier films for electroless copper deposition
Hong SW, Lee YS, Park KC, Park JW
Journal of the Electrochemical Society, 150(1), C16, 2003
89 Smad pathway is activated in the diabetic mouse kidney and Smad3 mediates TGF-beta-induced fibronectin in mesangial cells
Isono M, Chen S, Hong SW, Iglesias-de la Cruz MC, Ziyadeh FN
Biochemical and Biophysical Research Communications, 296(5), 1356, 2002
90 Effect of nitrogen content in TaNx (x=0-1) barrier substrates on electroless copper deposition
Hong SW, Park JW
Electrochemical and Solid State Letters, 5(12), C107, 2002