화학공학소재연구정보센터
검색결과 : 174건
No. Article
81 Effects of Surface Forces on Material Removal Rate in Chemical Mechanical Planarization
Bozkaya D, Muftu S
Journal of the Electrochemical Society, 157(3), H287, 2010
82 1H-Benzotriazole Incorporated Pad for Chemical Mechanical Planarization of Copper
Yu JF, Jia DM, Venkataraman SS, Li YZ
Journal of the Electrochemical Society, 157(3), H312, 2010
83 Effects of Addition of Resin Particles to Ceria-Based Slurry on Pre-Metal Dielectric Planarization
Matsui Y, Eda H, Seta S, Ono T, Tateyama Y, Nishioka T, Yano H, Masuko M
Journal of the Electrochemical Society, 157(5), H510, 2010
84 Study on Stiffness and Conditioning Effects of CMP Pad Based on Physical Die-Level CMP Model
Fan W, Boning D, Charns L, Miyauchi H, Tano H, Tsuji S
Journal of the Electrochemical Society, 157(5), H526, 2010
85 Effects of He Plasma Pretreatment on Low-k Damage during Cu Surface Cleaning with NH3 Plasma
Urbanowicz AM, Shamiryan D, Zaka A, Verdonck P, De Gendt S, Baklanov MR
Journal of the Electrochemical Society, 157(5), H565, 2010
86 Effect of copper barrier dielectric deposition process on characterization of copper interconnect
Cheng YL, Chiu TJ, Wei BJ, Wang HJ, Wu J, Wang YL
Journal of Vacuum Science & Technology B, 28(3), 567, 2010
87 InAlN/GaN heterostructure field-effect transistors on Fe-doped semi-insulating GaN substrates
Wu M, Leach JH, Ni X, Li X, Xie J, Dogan S, Ozgur U, Morkoc H, Paskova T, Preble E, Evans KR, Lu CZ
Journal of Vacuum Science & Technology B, 28(5), 908, 2010
88 Texture investigation in the trench depth direction of very fine copper wires less than 100 nm wide using electron backscatter diffraction
Khoo K, Onuki J
Thin Solid Films, 518(12), 3413, 2010
89 Chemical mechanical polishing of hard disk substrate with alpha-alumina-g-polystyrene sulfonic acid composite abrasive
Lei H, Bu NJ, Chen RL, Hao P, Neng SM, Tu XF, Yuen K
Thin Solid Films, 518(14), 3792, 2010
90 Mechanism of high selectivity in ceria based shallow trench isolation chemical mechanical polishing slurries
Manivannan R, Victoria SN, Ramanathan S
Thin Solid Films, 518(20), 5737, 2010