51 |
Direct observation of surface dangling bonds during plasma process: chemical reactions during H-2 and Ar plasma treatments Yamasaki S, Das UK, Ishikawa K Thin Solid Films, 407(1-2), 139, 2002 |
52 |
Modification of alumina supported platinum catalyst by tin tetraethyl in a circulation reactor Margitfalvi JL, Borbath I, Hegedus M, Gobolos S Applied Catalysis A: General, 219(1-2), 171, 2001 |
53 |
Estimation of coordination complex structure of O-Cu(I)-2-aminopyrimidine on a copper surface using X-ray photoelectron spectroscopy Miao Q, Yie XR, Xin XQ, Adachi H, Tanaka I Applied Surface Science, 171(1-2), 49, 2001 |
54 |
Spectromicroscopy of interfacial interactions between thin Ni films and a Au-Si surface Gregoratti L, Barinov A, Casalis L, Kiskinova M Applied Surface Science, 171(3-4), 265, 2001 |
55 |
Efficiencies above unity in light-induced reaction of Cu with Cl-2: excitation, amplification, and diffusion processes Raaf H, Schwentner N Applied Surface Science, 174(1), 13, 2001 |
56 |
The reduction mechanism of the C=O group. Part 3. The electrochemical reduction of benzil in aqueous medium Meunier-Prest R, Laviron E, Gaspard C, Raveau S Electrochimica Acta, 46(12), 1847, 2001 |
57 |
Reaction Mechanism and Control of Selectivity in Catalysis by Oxides: Some Challenges and Open Questions Centi G, Perathoner S International Journal of Molecular Sciences, 2(5), 183, 2001 |
58 |
On the growth mechanism of a-Si : H Kessels WMM, Smets AHM, Marra DC, Aydil ES, Schram DC, van de Sanden MCM Thin Solid Films, 383(1-2), 154, 2001 |
59 |
Gas-phase and plasma-surface reactions in radiofrequency discharges of C2H2-N-2-noble gas mixtures Durrant SF, de Moraes MAB, Rouxinol FP Thin Solid Films, 398-399, 156, 2001 |
60 |
Atomic layer epitaxy of copper: an ab initio investigation of the CuCl/H-2 process III. Reaction barriers Martensson P, Larsson K, Carlsson JO Applied Surface Science, 157(1-2), 92, 2000 |