화학공학소재연구정보센터
검색결과 : 128건
No. Article
51 Direct observation of surface dangling bonds during plasma process: chemical reactions during H-2 and Ar plasma treatments
Yamasaki S, Das UK, Ishikawa K
Thin Solid Films, 407(1-2), 139, 2002
52 Modification of alumina supported platinum catalyst by tin tetraethyl in a circulation reactor
Margitfalvi JL, Borbath I, Hegedus M, Gobolos S
Applied Catalysis A: General, 219(1-2), 171, 2001
53 Estimation of coordination complex structure of O-Cu(I)-2-aminopyrimidine on a copper surface using X-ray photoelectron spectroscopy
Miao Q, Yie XR, Xin XQ, Adachi H, Tanaka I
Applied Surface Science, 171(1-2), 49, 2001
54 Spectromicroscopy of interfacial interactions between thin Ni films and a Au-Si surface
Gregoratti L, Barinov A, Casalis L, Kiskinova M
Applied Surface Science, 171(3-4), 265, 2001
55 Efficiencies above unity in light-induced reaction of Cu with Cl-2: excitation, amplification, and diffusion processes
Raaf H, Schwentner N
Applied Surface Science, 174(1), 13, 2001
56 The reduction mechanism of the C=O group. Part 3. The electrochemical reduction of benzil in aqueous medium
Meunier-Prest R, Laviron E, Gaspard C, Raveau S
Electrochimica Acta, 46(12), 1847, 2001
57 Reaction Mechanism and Control of Selectivity in Catalysis by Oxides: Some Challenges and Open Questions
Centi G, Perathoner S
International Journal of Molecular Sciences, 2(5), 183, 2001
58 On the growth mechanism of a-Si : H
Kessels WMM, Smets AHM, Marra DC, Aydil ES, Schram DC, van de Sanden MCM
Thin Solid Films, 383(1-2), 154, 2001
59 Gas-phase and plasma-surface reactions in radiofrequency discharges of C2H2-N-2-noble gas mixtures
Durrant SF, de Moraes MAB, Rouxinol FP
Thin Solid Films, 398-399, 156, 2001
60 Atomic layer epitaxy of copper: an ab initio investigation of the CuCl/H-2 process III. Reaction barriers
Martensson P, Larsson K, Carlsson JO
Applied Surface Science, 157(1-2), 92, 2000