51 |
The Influences of Iodide Ion on Cu Electrodeposition and TSV Filling Kim MJ, Kim HC, Kim JJ Journal of the Electrochemical Society, 163(8), D434, 2016 |
52 |
구리 전해 도금을 이용한 실리콘 관통 비아 채움 공정 김회철, 김재정 Korean Chemical Engineering Research, 54(6), 723, 2016 |
53 |
Elucidating a Unified Mechanistic Scheme for the DBU-Catalyzed Ring-Opening Polymerization of Lactide to Poly(lactic acid) Sherck NJ, Kim HC, Won YY Macromolecules, 49(13), 4699, 2016 |
54 |
라지토우 폴리아크릴로니트릴계 탄소섬유의 안정화 공정에서 열 거동 유성욱, 박세준, 조한익, 이성호, 김환철, 방윤혁, 구본철 Polymer(Korea), 40(6), 972, 2016 |
55 |
Highly Transparent and Flexible Organic Light-Emitting Diodes with Structure Optimized for Anode/Cathode Multilayer Electrodes Kim DY, Han YC, Kim HC, Jeong EG, Choi KC Advanced Functional Materials, 25(46), 7145, 2015 |
56 |
Implementing bacterial acid resistance into cell-free protein synthesis for buffer-free expression and screening of enzymes Kim HC, Kim KS, Kang TJ, Choi JH, Song JJ, Choi YH, Kim BG, Kim DM Biotechnology and Bioengineering, 112(12), 2630, 2015 |
57 |
Graphene oxide-gellan gum-sodium alginate nanocomposites: synthesis, characterization, and mechanical behavior Mun S, Kim HC, Yadave M, Kim J Composite Interfaces, 22(4), 249, 2015 |
58 |
Monodispersed 3D MnWO4-TiO2 composite nanoflowers photocatalysts for environmental remediation Hassan MS, Amna T, Al-Deyab SS, Kim HC, Khil MS Current Applied Physics, 15(6), 753, 2015 |
59 |
Galvanostatic bottom-up filling of TSV-like trenches: Choline-based leveler containing two quaternary ammoniums Kim MJ, Seo Y, Kim HC, Lee Y, Choe S, Kim YG, Cho SK, Kim JJ Electrochimica Acta, 163, 174, 2015 |
60 |
In-line coagulation with quaternary amine polymer prior to microfiltration of humic-rich water Kim HC Journal of Colloid and Interface Science, 459, 151, 2015 |