화학공학소재연구정보센터
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No. Article
51 Oxidized polyethylene as a new alternative coupling agent for the fiberboards made from UF resin
Younesi-Kordkheili H, Pizzi A
Journal of Adhesion, 96(7), 665, 2020
52 Effect of different surface treatment protocols on the shear bond strength of perforation repair materials to resin composite
Nagi SM, Omar N, Salem HN, Aly Y
Journal of Adhesion Science and Technology, 34(4), 417, 2020
53 Does lining class-II cavities with flowable composite improve the interfacial adaptation?
Bakhsh TA, Sadr A, Shimada Y, Turkistani A, Abuljadayel R, Tagami J
Journal of Adhesion Science and Technology, 34(4), 400, 2020
54 Effect of different adhesive protocols on bond strength between composite resins for indirect use and repair materials
Isolan CP, Moreira AG, Ribeiro JS, Nakanishi L, Cuevas-Suarez CE
Journal of Adhesion Science and Technology, 34(1), 67, 2020
55 The preparation of SiCP/Ag-Cu-Ti hybrid tapes and application in the joining of silicon carbide ceramics
Liu Y, Tang M, Lin TS, Wu XS, Zhang H
Journal of Adhesion Science and Technology, 34(10), 1029, 2020
56 Determination of shear force capacity of H-type box furniture joints connected with different demountable type of connection elements
Yildirim MN, Karaman A, Uslu E
Journal of Adhesion Science and Technology, 34(8), 867, 2020
57 Strengthening of the adhesive bond using a mixture of adhesives between dissimilar adherends in a single lap joint
Jairaja R, Naik GN
Journal of Adhesion Science and Technology, 34(6), 579, 2020
58 A robust method of enhancement of corrosion inhibitive ability of electrodeposited poly-3-amino-5-mercapto-1,2,4-triazole films over copper surface using graphene oxide
Vinothkumar K, Sethuraman MG
Journal of Adhesion Science and Technology, 34(6), 651, 2020
59 Optimization of process parameters for rehabilitation of pipes through adhesive bonding: experimental study
Chokka SK, Ben BS, Srinadh KVS
Journal of Adhesion Science and Technology, 34(5), 497, 2020
60 Fabrication of high thermal conductivity copper/diamond composites by electrodeposition under potentiostatic conditions
Arai S, Ueda M
Journal of Applied Electrochemistry, 50(5), 631, 2020