| 51 |
Oxidized polyethylene as a new alternative coupling agent for the fiberboards made from UF resin
Younesi-Kordkheili H, Pizzi A
Journal of Adhesion, 96(7), 665, 2020 |
| 52 |
Effect of different surface treatment protocols on the shear bond strength of perforation repair materials to resin composite
Nagi SM, Omar N, Salem HN, Aly Y
Journal of Adhesion Science and Technology, 34(4), 417, 2020 |
| 53 |
Does lining class-II cavities with flowable composite improve the interfacial adaptation?
Bakhsh TA, Sadr A, Shimada Y, Turkistani A, Abuljadayel R, Tagami J
Journal of Adhesion Science and Technology, 34(4), 400, 2020 |
| 54 |
Effect of different adhesive protocols on bond strength between composite resins for indirect use and repair materials
Isolan CP, Moreira AG, Ribeiro JS, Nakanishi L, Cuevas-Suarez CE
Journal of Adhesion Science and Technology, 34(1), 67, 2020 |
| 55 |
The preparation of SiCP/Ag-Cu-Ti hybrid tapes and application in the joining of silicon carbide ceramics
Liu Y, Tang M, Lin TS, Wu XS, Zhang H
Journal of Adhesion Science and Technology, 34(10), 1029, 2020 |
| 56 |
Determination of shear force capacity of H-type box furniture joints connected with different demountable type of connection elements
Yildirim MN, Karaman A, Uslu E
Journal of Adhesion Science and Technology, 34(8), 867, 2020 |
| 57 |
Strengthening of the adhesive bond using a mixture of adhesives between dissimilar adherends in a single lap joint
Jairaja R, Naik GN
Journal of Adhesion Science and Technology, 34(6), 579, 2020 |
| 58 |
A robust method of enhancement of corrosion inhibitive ability of electrodeposited poly-3-amino-5-mercapto-1,2,4-triazole films over copper surface using graphene oxide
Vinothkumar K, Sethuraman MG
Journal of Adhesion Science and Technology, 34(6), 651, 2020 |
| 59 |
Optimization of process parameters for rehabilitation of pipes through adhesive bonding: experimental study
Chokka SK, Ben BS, Srinadh KVS
Journal of Adhesion Science and Technology, 34(5), 497, 2020 |
| 60 |
Fabrication of high thermal conductivity copper/diamond composites by electrodeposition under potentiostatic conditions
Arai S, Ueda M
Journal of Applied Electrochemistry, 50(5), 631, 2020 |
