화학공학소재연구정보센터
검색결과 : 174건
No. Article
51 Effect of concentric slanted pad groove patterns on slurry flow during chemical mechanical planarization
Rosales-Yeomans D, Lee H, Suzuki T, Philipossian A
Thin Solid Films, 520(6), 2224, 2012
52 Preparation of porous alumina abrasives and their chemical mechanical polishing behavior
Lei H, Wu X, Chen RL
Thin Solid Films, 520(7), 2868, 2012
53 Surface-complex films of guanidine on tantalum nitride electrochemically characterized for applications in chemical mechanical planarization
Rock SE, Crain DJ, Pettit CM, Roy D
Thin Solid Films, 520(7), 2892, 2012
54 Preparation of porous Fe2O3/SiO2 nanocomposite abrasives and their chemical mechanical polishing behaviors on hard disk substrates
Li H, Lei H, Chen RL
Thin Solid Films, 520(19), 6174, 2012
55 High polishing selectivity ceria slurry for formation of top electrode in spin-transfer torque magnetic random access memory
Cui H, Lim JH, Park JH, Park JG
Thin Solid Films, 522, 212, 2012
56 Effects of the ultrasonic flexural vibration on the interaction between the abrasive particles; pad and sapphire substrate during chemical mechanical polishing (CMP)
Xu WH, Lu XC, Pan GS, Lei YZ, Luo JB
Applied Surface Science, 257(7), 2905, 2011
57 Investigation of chemical mechanical polishing of zinc oxide thin films
Gupta S, Kumar P, Chakkaravathi AA, Craciun D, Singh RK
Applied Surface Science, 257(13), 5837, 2011
58 Polishing behavior of PS/CeO2 hybrid microspheres with controlled shell thickness on silicon dioxide CMP
Chen Y, Long RW
Applied Surface Science, 257(20), 8679, 2011
59 Preparation of monodisperse polystyrene/silica core-shell nano-composite abrasive with controllable size and its chemical mechanical polishing performance on copper
Zhang L, Wang HB, Zhang ZF, Qin F, Liu WL, Song ZT
Applied Surface Science, 258(3), 1217, 2011
60 An Approach for Correlating Friction Force and Removal Rate to Pad Topography during Tungsten Chemical Mechanical Planarization
Sampurno Y, Rice A, Zhuang Y, Philipossian A
Electrochemical and Solid State Letters, 14(8), H318, 2011