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Synthesis and characterization of novel fully aliphatic polyimidosiloxanes based on alicyclic or adamantyl diamides Mathews AS, Kim I, Ha CS Journal of Polymer Science Part A: Polymer Chemistry, 44(18), 5254, 2006 |
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Synthesis and properties of fluorinated polyimides from a new unsymmetrical diamine: 1,4-(2'-trifluoromethyl-4',4''-diaminodiphenoxy)benzene Shao Y, Li YF, Zhao X, Wang XL, Ma T, Yang FC Journal of Polymer Science Part A: Polymer Chemistry, 44(23), 6836, 2006 |
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Highly optically transparent/low color polyimide films prepared from hydroquinone- or resorcinol-based bis(ether anhydride) and trifluoromethyl-containing bis(ether amine)s Yang CP, Su YY, Wen SJ, Hsiao SH Polymer, 47(20), 7021, 2006 |
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Effect of Si-OH group on characteristics of SiCOH films prepared by decamethylcyclopentasiloxane electron cyclotron resonance plasma Ye C, Ning ZY, Wang TT, Yu XZ, Xin Y Thin Solid Films, 496(2), 221, 2006 |
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Characterization of sputter-induced temperature effect in fluorine doped SiO2 film deposition by high-density plasma chemical vapor deposition Hsiao WC, Liu CP, Wang YL Thin Solid Films, 498(1-2), 20, 2006 |
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Comparison of characteristics and integration of copper diffusion-barrier dielectrics Wang TC, Cheng YL, Wang YL, Hsieh TE, Hwang GJ, Chen CF Thin Solid Films, 498(1-2), 36, 2006 |
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Study of the morphologies and dielectric constants of nanoporous materials derived from benzoxazine-terminated poly(epsilon-caprolactone)/polybenzoxazine co-polymers Su YC, Chen WC, Ou KL, Chang FC Polymer, 46(11), 3758, 2005 |
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Effect of oxygen plasma treatment on low dielectric constant carbon-doped silicon oxide thin films Wang YH, Kumar R, Zhou X, Pan JS, Chai JW Thin Solid Films, 473(1), 132, 2005 |
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Synthesis and characterization of porous silsesquioxane dielectric films Yu S, Wong TKS, Hu X, Pita K Thin Solid Films, 473(2), 191, 2005 |
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Positron and positronium annihilation in low-dielectric-constant films studied by a pulsed positron beam Suzuki R, Ohdaira T, Kobayashi Y, Ito K, Yu RS, Shioya Y, Ichikawa H, Hosomi H, Ishikiriyama K, Shirataki H, Matsuno S, Xu J Materials Science Forum, 445-6, 224, 2004 |