| 471 |
Ferrite plating: a chemical method preparing oxide magnetic films at 24-100 degrees C, and its applications
Abe M
Electrochimica Acta, 45(20), 3337, 2000 |
| 472 |
Surface modification of poly(tetrafluoroethylene) films by graft copolymerization for adhesion enhancement with electrolessly deposited copper
Wu SY, Kang ET, Neoh KG
Journal of Adhesion Science and Technology, 14(11), 1451, 2000 |
| 473 |
Surface modification of poly(tetrafluoroethylene) films by plasma polymerization of glycidyl methacrylate and its relevance to the electroless deposition of copper
Yang GH, Kang ET, Neoh KG
Journal of Polymer Science Part A: Polymer Chemistry, 38(19), 3498, 2000 |
| 474 |
Removal and Recovery of Nickel Ion from Wastewater of Electroless Plating by Reduction Crystallization
Horikawa K, Hirasawa I
Korean Journal of Chemical Engineering, 17(6), 629, 2000 |
| 475 |
Cu pad위에 무전해 도금된 UBM (Under Bump Metallurgy)과 Pb-Sn-Ag 솔더 범프 계면 반응에 관한 연구
나재웅, 백경욱
Korean Journal of Materials Research, 10(12), 853, 2000 |
| 476 |
무전해 Co-W-P 합금 도금 층의 미세구조와 자기적 특성
윤성렬, 한승희, 김창욱
Korean Journal of Materials Research, 10(1), 97, 2000 |
| 477 |
Palladium seeding on the tantalum-insulated silicon oxide film by plasma immersion ion implantation for the growth of electroless Copper
Lin JH, Tsai YY, Chiu SY, Lee TL, Tsai CM, Chen PH, Lin CC, Feng MS, Kou CS, Shih HC
Thin Solid Films, 377-378, 592, 2000 |
| 478 |
Electroless copper plating on a glass substrate coated with ZnO film under UV illumination
Yang YA, Wei YB, Loo BH, Yao JN
Journal of Electroanalytical Chemistry, 462(2), 259, 1999 |
| 479 |
Repair of a Pd/alpha-Al2O3 composite membrane containing defects
Li AW, Liang WQ, Hughes R
Separation and Purification Technology, 15(2), 113, 1999 |
| 480 |
TPR STUDY OF ELECTROLESS PLATED COPPER CATALYSTS
Chang HF, Lin WH
Korean Journal of Chemical Engineering, 15(5), 559, 1998 |
