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Investigation of the curing behavior of a novel epoxy photo-dielectric dry film (ViaLux (TM) 81) for high density interconnect applications Dunne RC, Sitaraman SK, Luo SJ, Rao Y, Wong CP, Estes WE, Gonzalez CG, Coburn JC, Periyasamy M Journal of Applied Polymer Science, 78(2), 430, 2000 |
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Material and process studies in the integration of plasma-promoted chemical-vapor deposition of aluminum with benzocyclobutene low-dielectric constant polymer Talevi R, Gundlach H, Bian ZL, Knorr A, van Gestel M, Padiyar S, Kaloyeros AE, Geer RE, Shaffer EO, Martin S Journal of Vacuum Science & Technology B, 18(1), 252, 2000 |
383 |
Characteristics of lanthanum strontium chromite prepared by glycine nitrate process Yang YJ, Wen TL, Tu HY, Wang DQ, Yang JH Solid State Ionics, 135(1-4), 475, 2000 |
384 |
Fluorinated amorphous carbon films for low permittivity interlevel dielectrics Theil JA Journal of Vacuum Science & Technology B, 17(6), 2397, 1999 |
385 |
Mechanical properties of calcium- and strontium-substituted lanthanum chromite Paulik SW, Baskaran S, Armstrong TR Journal of Materials Science, 33(9), 2397, 1998 |
386 |
Passivation of Cu by sputter-deposited Ta and reactively sputter-deposited Ta-nitride layers Chuang JC, Chen NC Journal of the Electrochemical Society, 145(9), 3170, 1998 |
387 |
Effects of thermal N-2 annealing on passivation capability of sputtered Ta(-N) layers against Cu oxidation Chuang JC, Chen MC Journal of the Electrochemical Society, 145(11), 4029, 1998 |
388 |
Interface formation between metals (Cu, Ti) and low dielectric constant organic polymer (FLARE (TM) 1.0) Du M, Opila RL, Case C Journal of Vacuum Science & Technology A, 16(1), 155, 1998 |
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Properties of sputtered Cr-O and reactively sputtered Cr-N-O as passivation layers against copper oxidation Chuang JC, Chen MC Journal of Vacuum Science & Technology B, 16(6), 3021, 1998 |