화학공학소재연구정보센터
검색결과 : 297건
No. Article
291 Vacuum Requirements for Next Wafer Size Physical Vapor-Deposition System
Hashim I, Raaijmakers IJ, Park SE, Kim KB
Journal of Vacuum Science & Technology A, 15(3), 1305, 1997
292 Analysis of Solute Redistribution in the Fractionally Solidified Al Ingot
Kim KM, Yoon EP, Kim KB
Journal of Materials Science Letters, 15(9), 770, 1996
293 Low-Pressure Chemical-Vapor-Deposition of Si1-xGex Films Using Si2H6 and GeH4 Source Gases
Kim JW, Ryu MK, Kim KB, Kim SJ
Journal of the Electrochemical Society, 143(1), 363, 1996
294 Comparative-Study of Tantalum and Tantalum Nitrides (Ta2N and Tan) as a Diffusion Barrier for Cu Metallization
Min KH, Chun KC, Kim KB
Journal of Vacuum Science & Technology B, 14(5), 3263, 1996
295 Effect of Annealing of Titanium Nitride on the Diffusion Barrier Property in Cu Metallization
Park KC, Kim KB
Journal of the Electrochemical Society, 142(9), 3109, 1995
296 Iterative Learning Control for a Class of Nonlinear-Systems
Ahn HS, Choi CH, Kim KB
Automatica, 29(6), 1575, 1993
297 자동회귀이동평균 모델에 의한 고로내 용선온도의 실시간대 예측
최태화, 이일옥, 이광순, 김기병
HWAHAK KONGHAK, 26(3), 237, 1988