화학공학소재연구정보센터
검색결과 : 60건
No. Article
21 Backcontact CdSe/CdTe windowless solar cells
Kim DU, Hangarter CM, Debnath R, Ha JY, Beauchamp CR, Widstrom MD, Guyer JE, Nguyen N, Yoo BY, Josell D
Solar Energy Materials and Solar Cells, 109, 246, 2013
22 Extreme Bottom-Up Superfilling of Through-Silicon-Vias by Damascene Processing: Suppressor Disruption, Positive Feedback and Turing Patterns
Moffat TP, Josell D
Journal of the Electrochemical Society, 159(4), D208, 2012
23 Modeling Extreme Bottom-Up Filling of Through Silicon Vias
Josell D, Wheeler D, Moffat TP
Journal of the Electrochemical Society, 159(10), D570, 2012
24 Fracture behavior of nano-layered coatings under tension
Chai H, Josell D
Thin Solid Films, 519(1), 331, 2010
25 Three Dimensionally Structured CdTe Thin-Film Photovoltaic Devices with Self-Aligned Back-Contacts: Electrodeposition on Interdigitated Electrodes
Josell D, Beauchamp CR, Jung S, Hamadani BH, Motayed A, Richter LJ, Williams M, Bonevich JE, Shapiro A, Zhitenev N, Moffat TP
Journal of the Electrochemical Society, 156(8), H654, 2009
26 Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing
Moffat TP, Wheeler D, Kim SK, Josell D
Electrochimica Acta, 53(1), 145, 2007
27 Superfilling when adsorbed accelerators are mobile
Josell D, Moffat TP, Wheeler D
Journal of the Electrochemical Society, 154(4), D208, 2007
28 Electrodeposition of ni in submicrometer trenches
Kim SK, Bonevich JE, Josell D, Moffat TP
Journal of the Electrochemical Society, 154(9), D443, 2007
29 Osmium barriers for direct copper electrodeposition in Damascene processing
Josell D, Witt C, Moffat TP
Electrochemical and Solid State Letters, 9(2), C41, 2006
30 Iridium barriers for direct copper electrodeposition in damascene processing
Josell D, Bonevich JE, Moffat TP, Aaltonen T, Ritala M, Leskela M
Electrochemical and Solid State Letters, 9(2), C48, 2006