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Kinetic regimes in the curing process of epoxy-phenol composites Granado L, Kempa S, Gregoriades LJ, Bruning F, Genix AC, Frety N, Anglaret E Thermochimica Acta, 667, 185, 2018 |
12 |
Curing of epoxidized soybean oil with crystalline oligomeric poly (butylene succinate) towards high performance and sustainable epoxy resins Jian XY, He Y, Li YD, Wang M, Zeng JB Chemical Engineering Journal, 326, 875, 2017 |
13 |
Organic-inorganic polybenzoxazine copolymers with double decker silsesquioxanes in the main chains: Synthesis and thermally activated ring-opening polymerization behavior Liu N, Li L, Wang L, Zheng SX Polymer, 109, 254, 2017 |
14 |
Synthesis and characterization of various phenylene diamine-based bismaleimide-containing phthalonitrile resins Kaliavaradhan K, Muthusamy S Polymer Bulletin, 73(7), 1921, 2016 |
15 |
A dynamic mechanical analysis method for predicting the curing behavior of phenol-formaldehyde resin adhesive Lei H, Frazier CE Journal of Adhesion Science and Technology, 29(10), 981, 2015 |
16 |
An investigation of the effects of pre-polymer functionality on the curing behavior and mechanical properties of HTPB-based polyurethane Toosi FS, Shahidzadeh M, Ramezanzadeh B Journal of Industrial and Engineering Chemistry, 24, 166, 2015 |
17 |
Synthesis, curing behavior and thermal properties of fluorene-containing benzoxazines based on linear and branched butylamines Wang J, Ren TT, Wang YD, He XY, Liu WB, Shen XD Reactive & Functional Polymers, 74, 22, 2014 |
18 |
Curing behavior and thermal properties of TGDDM copolymerized with a new pyridine-containing diamine and with DDM or DDS Mustafa MF, Cook WD, Schiller TL, Siddiqi HM Thermochimica Acta, 575, 21, 2014 |
19 |
The influence of tertiary amine accelerators on the curing behaviors of epoxy/anhydride systems Yang T, Zhang CF, Zhang JY, Cheng J Thermochimica Acta, 577, 11, 2014 |
20 |
Fabrication of optically clear acrylic pressure-sensitive adhesive by photo-polymerization: UV-curing behavior, adhesion performance, and optical properties Kim S, Lee SW, Lim DH, Park JW, Park CH, Kim HJ Journal of Adhesion Science and Technology, 27(20), 2177, 2013 |