화학공학소재연구정보센터
검색결과 : 59건
No. Article
11 Kinetic regimes in the curing process of epoxy-phenol composites
Granado L, Kempa S, Gregoriades LJ, Bruning F, Genix AC, Frety N, Anglaret E
Thermochimica Acta, 667, 185, 2018
12 Curing of epoxidized soybean oil with crystalline oligomeric poly (butylene succinate) towards high performance and sustainable epoxy resins
Jian XY, He Y, Li YD, Wang M, Zeng JB
Chemical Engineering Journal, 326, 875, 2017
13 Organic-inorganic polybenzoxazine copolymers with double decker silsesquioxanes in the main chains: Synthesis and thermally activated ring-opening polymerization behavior
Liu N, Li L, Wang L, Zheng SX
Polymer, 109, 254, 2017
14 Synthesis and characterization of various phenylene diamine-based bismaleimide-containing phthalonitrile resins
Kaliavaradhan K, Muthusamy S
Polymer Bulletin, 73(7), 1921, 2016
15 A dynamic mechanical analysis method for predicting the curing behavior of phenol-formaldehyde resin adhesive
Lei H, Frazier CE
Journal of Adhesion Science and Technology, 29(10), 981, 2015
16 An investigation of the effects of pre-polymer functionality on the curing behavior and mechanical properties of HTPB-based polyurethane
Toosi FS, Shahidzadeh M, Ramezanzadeh B
Journal of Industrial and Engineering Chemistry, 24, 166, 2015
17 Synthesis, curing behavior and thermal properties of fluorene-containing benzoxazines based on linear and branched butylamines
Wang J, Ren TT, Wang YD, He XY, Liu WB, Shen XD
Reactive & Functional Polymers, 74, 22, 2014
18 Curing behavior and thermal properties of TGDDM copolymerized with a new pyridine-containing diamine and with DDM or DDS
Mustafa MF, Cook WD, Schiller TL, Siddiqi HM
Thermochimica Acta, 575, 21, 2014
19 The influence of tertiary amine accelerators on the curing behaviors of epoxy/anhydride systems
Yang T, Zhang CF, Zhang JY, Cheng J
Thermochimica Acta, 577, 11, 2014
20 Fabrication of optically clear acrylic pressure-sensitive adhesive by photo-polymerization: UV-curing behavior, adhesion performance, and optical properties
Kim S, Lee SW, Lim DH, Park JW, Park CH, Kim HJ
Journal of Adhesion Science and Technology, 27(20), 2177, 2013