화학공학소재연구정보센터
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No. Article
11 Superconformal Bottom-Up Nickel Deposition in High Aspect Ratio Through Silicon Vias
Josell D, Moffat TP
Journal of the Electrochemical Society, 163(7), D322, 2016
12 Superconformal Bottom-Up Cobalt Deposition in High Aspect Ratio Through Silicon Vias
Josell D, Silva M, Moffat TP
Journal of the Electrochemical Society, 163(14), D809, 2016
13 Bottom-Up Electrodeposition of Zinc in Through Silicon Vias
Josell D, Moffat TP
Journal of the Electrochemical Society, 162(3), D129, 2015
14 Morphological Transitions during Au Electrodeposition: From Porous Films to Compact Films and Nanowires
Josell D, Levin I, Moffat TP
Journal of the Electrochemical Society, 162(12), D556, 2015
15 Superconformal Copper Electrodeposition in Complexed Alkaline Electrolyte
Josell D, Moffat TP
Journal of the Electrochemical Society, 161(5), D287, 2014
16 Superconformal Cu Electrodeposition from Cu(II)-EDTA Complexed Alkaline Electrolyte
Josell D, Moffat TP
Journal of the Electrochemical Society, 161(10), D558, 2014
17 Superfilling Damascene Trenches with Gold in a Sulfite Electrolyte
Josell D, Moffat TP
Journal of the Electrochemical Society, 160(12), D3009, 2013
18 Extreme Bottom-up Filling of Through Silicon Vias and Damascene Trenches with Gold in a Sulfite Electrolyte
Josell D, Moffat TP
Journal of the Electrochemical Society, 160(12), D3035, 2013
19 Spatial-Temporal Modeling of Extreme Bottom-up Filling of Through-Silicon-Vias
Wheeler D, Moffat TP, Josell D
Journal of the Electrochemical Society, 160(12), D3260, 2013
20 Electrochemical Processing of Interconnects
Moffat TP, Josell D
Journal of the Electrochemical Society, 160(12), Y7, 2013