11 |
Void-free strong bonding of surface activated silicon wafers from room temperature to annealing at 600 degrees C Howlader MMR, Zhang F Thin Solid Films, 519(2), 804, 2010 |
12 |
Fabrication of multilayer thin film filters by hydrofluoric acid bonding Chen L, Nishimura H, Fukumi K, Nishii J, Hirao K Applied Surface Science, 253(11), 4906, 2007 |
13 |
Photoemission spectroscopic studies on oxide/SiC interfaces formed by dry and pyrogenic oxidation Hijikata Y, Yaguchi H, Ishida Y, Yoshikawa M, Kamiya T, Yoshida S Materials Science Forum, 457-460, 1341, 2004 |
14 |
Permanent aluminium foam cores in castings: Casting processes and fabrication conditions of foam filled parts Kretz R Materials Science Forum, 396-4, 1609, 2002 |
15 |
Characterization of henequen fibers and the henequen fiber/poly(hydroxybutyrate-co-hydroxyvalerate) interface Luo S, Netravali AN Journal of Adhesion Science and Technology, 15(4), 423, 2001 |
16 |
칼슘이 첨가된 란탄-아크롬산 염과 이트리아 안정화 지르코니아 계면간의 반응 최진삼 Korean Journal of Materials Research, 11(6), 460, 2001 |
17 |
Limitations for aggressively scaled CMOS Si devices due to bond coordination constraints and reduced band offset energies at Si-high-k dielectric interfaces Lucovsky G, Phillips JC Applied Surface Science, 166(1-4), 497, 2000 |