화학공학소재연구정보센터
검색결과 : 26건
No. Article
11 pH-dependent degradation of p-nitrophenol by sulfidated nanoscale zerovalent iron under aerobic or anoxic conditions
Tang J, Tang L, Feng HP, Zeng GM, Dong HR, Zhang C, Huang BB, Deng YC, Wang JJ, Zhou YY
Journal of Hazardous Materials, 320, 581, 2016
12 Masking autoprocessing of Clostridium difficile toxin A by the C-terminus combined repetitive oligo peptides
Zhang YR, Hamza T, Gao S, Feng HP
Biochemical and Biophysical Research Communications, 459(2), 259, 2015
13 Apoptosis of CT26 colorectal cancer cells induced by Clostridium difficile toxin A stimulates potent anti-tumor immunity
Tian Y, Huang TX, Li GC, Liu J, Wang XN, Feng HP, Wang JF
Biochemical and Biophysical Research Communications, 422(1), 15, 2012
14 Apoptosis of CT26 colorectal cancer cells induced by Clostridium difficile toxin A stimulates potent anti-tumor immunity (Retraction of vol 422, pg 15, 2012)
Tian Y, Huang TX, Li GC, Liu J, Wang XN, Feng HP, Wang JF
Biochemical and Biophysical Research Communications, 425(1), 119, 2012
15 Nanoparticle-Enabled Selective Electrodeposition
Feng HP, Paudel T, Yu B, Chen S, Ren ZF, Chen G
Advanced Materials, 23(21), 2454, 2011
16 Studies on surface preparation and smoothness of nanostructured Bi2Te3-based alloys by electrochemical and mechanical methods
Feng HP, Yu B, Chen S, Collins K, He C, Ren ZF, Chen G
Electrochimica Acta, 56(8), 3079, 2011
17 High-performance flat-panel solar thermoelectric generators with high thermal concentration
Kraemer D, Poudel B, Feng HP, Caylor JC, Yu B, Yan X, Ma Y, Wang XW, Wang DZ, Muto A, McEnaney K, Chiesa M, Ren ZF, Chen G
Nature Materials, 10(7), 532, 2011
18 Effects of direct current and pulse-reverse copper plating incubation behavior of self-annealing
Cheng MY, Chen KW, Liu TF, Wang YL, Feng HP
Thin Solid Films, 518(24), 7468, 2010
19 Behavior of copper removal by CMP and its correlation to deposit structure and impurity content
Feng HP, Lin JY, Cheng MY, Wang YY, Wan CC
Journal of the Electrochemical Society, 155(1), H21, 2008
20 Effect of impurity and illumination on copper oxidation after chemical mechanical polishing
Feng HP, Lin JY, Wang YY, Wan CC
Journal of the Electrochemical Society, 155(8), H620, 2008