화학공학소재연구정보센터
검색결과 : 199건
No. Article
141 Fracture toughness of a silane coupled polymer-metal interface: Silane concentration effects
Berry DH, Namkanisorn A
Journal of Adhesion, 81(3-4), 347, 2005
142 Interphase variation in silane-treated glass-fiber-reinforced epoxy composites
Griswold C, Cross WM, Kjerengtroen L, Kellar JJ
Journal of Adhesion Science and Technology, 19(3-5), 279, 2005
143 Effects of surface properties of colloidal silica particles on redispersibility and properties of acrylic-based polyurethane/silica composites
Chen GD, Zhou SX, Gu GX, Yang HH, Wu LM
Journal of Colloid and Interface Science, 281(2), 339, 2005
144 Formation and Characterization of Silica-Coated Magnetic Nanoparticles by Sol-Gel Method
Kim KD, Kim SS, Kim HT
Journal of Industrial and Engineering Chemistry, 11(4), 584, 2005
145 Surface and Chemical Properties of Surface-Modified UHMWPE Powder and Mechanical and Thermal Properties of Its Impregnated PMMA Bone Cement V. Effect of Silane Coupling Agent on the Surface Modification of UHMWPE Powder
Yang DH, Yoon GH, Shin GJ, Kim SH, Rhee JM, Khang G, Lee HB
Macromolecular Research, 13(2), 120, 2005
146 Adhesion between an underfill and the passivation layer in flip-chip packaging
Luo SJ, Wong CP
Journal of Adhesion Science and Technology, 18(2), 275, 2004
147 Effect of coupling agent on the mechanical properties of fly ash-filled polybutadiene rubber
Alkadasi NAN, Hundiwale DG, Kapadi UR
Journal of Applied Polymer Science, 91(2), 1322, 2004
148 Microstructure and Phase Behavior of Concentrated Silica Particle Suspensions
So JH, Oh WK, Yang SM
Korean Journal of Chemical Engineering, 21(5), 921, 2004
149 Influence of Silane Coupling Agents on the Interlaminar and Thermal Properties of Woven Glass Fabric/Nylon 6 Composites
Cho D, Yun SH, Kim J, Lim S, Park M, Lee SS, Lee GW
Macromolecular Research, 12(1), 119, 2004
150 Using self-assembled monolayer technology to probe the mechanical response of the fiber interphase-matrix interphase interface
Holmes GA, Feresenbet E, Raghavan D
Composite Interfaces, 10(6), 515, 2003