화학공학소재연구정보센터
검색결과 : 117건
No. Article
101 Influence of copper anion complexes on the incorporation of metal particles in polyaniline - Part II: Copper oxalate complex
Ivanov S, Tsakova V
Journal of Applied Electrochemistry, 32(6), 709, 2002
102 Copper electrodeposition from a pH 3 sulfate electrolyte
Vicenzo A, Cavallotti PL
Journal of Applied Electrochemistry, 32(7), 743, 2002
103 Mechanism of copper electrodeposition by pulse current and its relation to current efficiency
Tsai WC, Wan CC, Wang YY
Journal of Applied Electrochemistry, 32(12), 1371, 2002
104 Nicotinic acid as brightener agent in copper electrodeposition
Portela AL, Lacconi GI, Teijelo ML
Journal of Electroanalytical Chemistry, 495(2), 169, 2001
105 The presence of the positron diffusion process in the annihilation characteristics in classical experiments
Dryzek J
Materials Science Forum, 363-3, 597, 2001
106 Influence of additives on characterisation and high temperature corrosion of electrodeposited copper and nickel
Bertrand C, Daltin AL, Douglade J, Toesca S
Materials Science Forum, 369-3, 215, 2001
107 Nature of the photographic diamond surface phenomenon on boron-doped diamond
Yoshihara S, Shinozaki K, Zenbayashi T, Morino S, Shirakashi T, Hashimoto K, Tryk DA, Fujishima A
Electrochimica Acta, 45(20), 3375, 2000
108 Some aspects of removal of copper and cobalt from mixed ion dilute solutions
Pilla AS, Duarte MME, Mayer CE
Journal of Applied Electrochemistry, 30(7), 831, 2000
109 Influence of noncoherent nucleation on the formation of the polycrystalline structure of metals electrodeposited in the presence of surface-active agents
Kozlov VM, Bicelli LP
Materials Chemistry and Physics, 62(2), 158, 2000
110 Programmable ward-wiring of circuitry using spatially coupled bipolar electrochemistry
Bradley JC, Ma ZM, Clark E, Crawford J, Stephens SG
Journal of the Electrochemical Society, 146(1), 194, 1999