| 91 |
Pendant Crosslinked Poly(aryl ether sulfone) Copolymers Sulfonated on Backbone for Proton Exchange Membranes
Li DS, Li ZM, Hu F, Long SR, Zhang G, Yang J
Polymer Engineering and Science, 54(9), 2013, 2014 |
| 92 |
Improvement of acetoin reductase activity enhances bacitracin production by Bacillus licheniformis
Wang Z, Wang Y, Xie FL, Chen SW, Li JH, Li DS, Chen X
Process Biochemistry, 49(12), 2039, 2014 |
| 93 |
Fluoride and Arsenic Removal by Nanofiltration Technology from Groundwater in Rural Areas of China: Performances with Membrane Optimization
Xi BD, Wang XW, Liu WJ, Xia XF, Li DS, He LS, Wang HM, Sun WJ, Yang TX, Tao W
Separation Science and Technology, 49(17), 2642, 2014 |
| 94 |
Phase Transformations and Structural Developments in the Radular Teeth of Cryptochiton Stelleri
Wang QQ, Nemoto M, Li DS, Weaver JC, Weden B, Stegemeier J, Bozhilov KN, Wood LR, Milliron GW, Kim CS, DiMasi E, Kisailus D
Advanced Functional Materials, 23(23), 2908, 2013 |
| 95 |
Formation of nanostructured emitter for silicon solar cells using catalytic silver nanoparticles
Li D, Wang L, Li DS, Zhou N, Feng ZQ, Zhong XP, Yang DR
Applied Surface Science, 264, 621, 2013 |
| 96 |
Surface plasmon response of metal spherical nanoshells coated with dielectric overlayer
Cheng PH, Bao JL, Wu LG, Li X, Zhao HX, Zhu RX, Wang JX, Li DS
Chemical Physics Letters, 587, 40, 2013 |
| 97 |
The influence of SiCp oxidized on the interface layer and thermal conductivity of SiCp/Al composites
Zou AH, Zhou XL, Li DS, Yu YW
Composite Interfaces, 20(2), 107, 2013 |
| 98 |
Effects of Thioether Content on the Solubility and Thermal Properties of Aromatic Polyesters
Zhang G, Xing XJ, Li DS, Wang XJ, Yang J
Industrial & Engineering Chemistry Research, 52(47), 16577, 2013 |
| 99 |
Co-5/Co-8-Cluster-Based Coordination Polymers Showing High-Connected Self-Penetrating Networks: Syntheses, Crystal Structures, and Magnetic Properties
Li DS, Zhao J, Wu YP, Liu B, Bai L, Zou K, Du M
Inorganic Chemistry, 52(14), 8091, 2013 |
| 100 |
Formulation and Characterization of Electrically Conductive Adhesives for Electronic Packaging
Cui HW, Fan Q, Li DS, Tang X
Journal of Adhesion, 89(1), 19, 2013 |
