화학공학소재연구정보센터
검색결과 : 123건
No. Article
91 Small signal amplification using parametric resonance in NcAFM imaging
Patil S, Dharmadhikari C
Applied Surface Science, 217(1-4), 7, 2003
92 Influence of surface morphology on the adhesion strength of epoxy-aluminum interfaces
Zhang S, Panat R, Hsia KJ
Journal of Adhesion Science and Technology, 17(12), 1685, 2003
93 Dynamic-mode AFM using the piezoelectric cantilever: investigations of local optical and electrical properties
Satoh N, Kobayashi K, Watanabe S, Fujii T, Horiuchi T, Yamada H, Matsushige K
Applied Surface Science, 188(3-4), 425, 2002
94 Non-contact atomic force microscope with a PZT cantilever used for deflection sensing, direct oscillation and feedback actuation
Miyahara Y, Deschler M, Fujii T, Watanabe S, Bleuler H
Applied Surface Science, 188(3-4), 450, 2002
95 Improved analytical models for mixed-mode bending tests of adhesively bonded joints
Liu Z, Gibson RF, Newaz GM
Journal of Adhesion, 78(3), 245, 2002
96 Homoepitaxial'web growth' of SiC to terminate C-axis screw dislocations and-enlarge step-free surfaces
Neudeck PG, Powell JA, Trunek A, Spry D, Beheim GM, Benavage E, Abel P, Vetter WM, Dudley M
Materials Science Forum, 389-3, 251, 2002
97 Single- and double-hot arm asymmetrical polysilicon surface micromachined electrothermal microactuators applied to realize a microengine
Kolesar ES, Ruff MD, Odom WE, Jayachadran JA, McAllister JB, Ko SY, Howard JT, Allen PB, Wilken JM, Boydston NC, Bosch JE, Wilks RJ
Thin Solid Films, 420-421, 530, 2002
98 The effect of damage nucleation on the toughness of an adhesive joint
Cavalli MN, Thouless MD
Journal of Adhesion, 76(1), 75, 2001
99 Fracture mechanics testing of the bond between composite overlays and a concrete substrate
Giurgiutiu V, Lyons J, Petrou M, Laub D, Whitley S
Journal of Adhesion Science and Technology, 15(11), 1351, 2001
100 Effect of annealing treatment on the stress corrosion cracking behavior of SiC whisker reinforced aluminum composite
Hu J, Luo RS, Yao CK, Zhao LC
Materials Chemistry and Physics, 70(2), 160, 2001