화학공학소재연구정보센터
검색결과 : 81건
No. Article
1 Porous boron nitride/polyimide composite films with high thermal diffusivity and low dielectric properties via high internal phase Pickering emulsion method
Yang KS, Kang YY, Ahn HJ, Kim DG, Park NK, Choi SQ, Won JC, Kim YH
Journal of Industrial and Engineering Chemistry, 82, 173, 2020
2 Decreasing the dielectric constant and water uptake by introducing hydrophobic cross-linked networks into co-polyimide films
Song NN, Yao HY, Ma TN, Wang TJ, Shi KX, Tian Y, Zhang B, Zhu SY, Zhang YH, Guan SW
Applied Surface Science, 480, 990, 2019
3 Novel high-performance poly(benzoxazole-co-imide) resins with low dielectric constants and superior thermal stabilities derived from thermal rearrangement of ortho-hydroxy polyimide oligomers
Li XT, Liu T, Jiao YZ, Dong J, Gan F, Zhao X, Zhang QH
Chemical Engineering Journal, 359, 641, 2019
4 Synthesis and studies on phosphazene core-based POSS-reinforced polyimide nanocomposites
Revathi R, Prabunathan P, Alagar M
Polymer Bulletin, 76(1), 387, 2019
5 Barrier-free process for fluorinated silicon glass film in Cu interconnects
Cheng YL, Lee CY, Huang WJ, Chen GS, Fang JS
Thin Solid Films, 678, 1, 2019
6 Effect of the C-bridge on UV properties of organosilicate films
Seregin DS, Naumov S, Chang WY, Wu YH, Wang Y, Kotova NM, Vishnevskiy AS, Wei S, Zhang J, Vorotilov KA, Redzheb M, Leu J, Baklanov MR
Thin Solid Films, 685, 329, 2019
7 Low dielectric constant and moisture-resistant polyimide aerogels containing trifluoromethyl pendent groups
Wu TT, Dong J, Gan F, Fang YT, Zhao X, Zhang QH
Applied Surface Science, 440, 595, 2018
8 저유전율을 가지는 D-Glass Fiber의 제조 및 특성
정보라, 이지선, 이미재, 임태영, 이영진, 전대우, 신동욱, 김진호
Korean Journal of Materials Research, 28(4), 254, 2018
9 Low dielectric constant silica-containing cross-linked organic-inorganic materials based on fluorinated poly(arylene ether)s
Tkachenko I, Kononevich Y, Kobzar Y, Purikova O, Yakovlev Y, Khalakhan I, Muzafarov A, Shevchenko V
Polymer, 157, 131, 2018
10 Characteristics of low-kappa SiOC films deposited via atomic layer deposition
Lee J, Jang W, Kim H, Shin S, Kweon Y, Lee K, Jeon H
Thin Solid Films, 645, 334, 2018