화학공학소재연구정보센터
검색결과 : 409건
No. Article
1 프라임, 테스트 등급 실리콘 웨이퍼의 표면 결함 특성
오승환, 임현민, 이동희, 서동혁, 김원진, 김륜나, 김우병
Korean Journal of Materials Research, 32(9), 396, 2022
2 Study on efficiency improvement of multi-crystalline silicon solar cell by removing by-product and plasma induced damage generated during reactive ion etching
Kim MJ, Min KH, Park S, Song HE, Lee JI, Jeong KT, Park JS, Kang MG
Current Applied Physics, 20(4), 519, 2020
3 Hydrothermal formation of controllable hexagonal holes and Er2O3/Er2O3-RGO particles on silicon wafers toward superhydrophobic surfaces
Peng C, Wu RX, Yang YHN, Li C, Lin YX, Chen S, Kuai ZY, Li L
Journal of Colloid and Interface Science, 580, 768, 2020
4 Fabrication of surface enhanced Raman spectroscopy substrates on solid supports
Mhlanga N, Domfe T, Skepu A
Applied Surface Science, 476, 1108, 2019
5 De-bondable SiC-SiC wafer bonding via an intermediate Ni nano-film
Mu FW, Uomoto M, Shimatsu T, Wang YH, Iguchi K, Nakazawa H, Takahashi Y, Higurashi E, Suga T
Applied Surface Science, 465, 591, 2019
6 Self-assembled monolayer of multiply-alkylated cyclopentenes on silicon via thiol-ene "click" reaction and its self-lubricating properties
Huo LX, Du PC, Zhang KF, Liu P, Zhou H
Applied Surface Science, 477, 96, 2019
7 High-performance FET arrays enabled by improved uniformity of wafer-scale MoS2 synthesized via thermal vapor sulfurization
Wei JQ, Wang F, Zhang BJ, Shan X, Di XC, Li Y, Feng YL, Zhang KL
Applied Surface Science, 483, 1136, 2019
8 Interface characteristics comparison of sapphire direct and indirect wafer bonded structures by transmission electron microscopy
Li WW, Liang T, Liu WY, Lei C, Hong YP, Li YW, Li ZQ, Xiong JJ
Applied Surface Science, 494, 566, 2019
9 Analytical prediction for depth of subsurface damage in silicon wafer due to self-rotating grinding process
Zhang LX, Chen P, An T, Dai YW, Qin F
Current Applied Physics, 19(5), 570, 2019
10 Numerical investigation of wafer drying induced by the thermal Marangoni effect
Li CK, Zhao DW, Wen JL, Lu XC
International Journal of Heat and Mass Transfer, 132, 689, 2019