화학공학소재연구정보센터
검색결과 : 26건
No. Article
1 In-situ SAXS study of the mesoscale deformation of polyethylene in the pre-yield strain domain: Influence of microstructure and temperature
Xiong BJ, Lame O, Chenal JM, Rochas C, Seguela R, Vigier G
Polymer, 55(5), 1223, 2014
2 Effects of elastic deformation on the anodic dissolution of X70 carbon steel in sulfuric acid solution
Zhu YY, Li L, Wang C, Luo JL, Gao GF, Zhang JL
Electrochimica Acta, 78, 609, 2012
3 An experimental evaluation of the accuracy to simulate granule bed compression using the discrete element method
Persson AS, Frenning G
Powder Technology, 219, 249, 2012
4 Effects of Electrostatic and Capillary Forces and Surface Deformation on Particle Detachment in Turbulent Flows
Zhang XY, Ahmadi G
Journal of Adhesion Science and Technology, 25(11), 1175, 2011
5 Formation and relaxation of the elastic strain generated by photocuring in polymer blends monitored by Mach-Zehnder interferometry
Van-Pham DT, Sorioka K, Norisuye T, Tran-Cong-Miyata Q
Polymer, 52(3), 739, 2011
6 An experimental study on the criteria for failure of polymer melts in uniaxial extension: The test case of a polyisobutylene melt in different deformation regimes
Barroso VC, Andrade RJ, Maia JM
Journal of Rheology, 54(3), 605, 2010
7 Direct measurement of particle-particle interaction using micro particle interaction analyzer (MPIA)
Abu Bakar NF, Anzai R, Horio M
Advanced Powder Technology, 20(5), 455, 2009
8 Modelling of forward roll coating flows with a deformable roll: Application to non-Newtonian industrial coating formulations
Lecuyer HA, Mmbaga JP, Hayes RE, Bertrand FH, Tanguy PA
Computers & Chemical Engineering, 33(9), 1427, 2009
9 Raman Microscopy and Scanning Surface Potential Microscopy Analysis of Nanoscale Defects on Si Wafer Surfaces
Homma T, Kato M, Kubo N, Sakata K, Yanagisawa M
Journal of the Electrochemical Society, 156(6), H475, 2009
10 Micropatterning of polymeric semiconductor by selective lift-off method using epoxy mold
Wang Z, Yu XH, Xing RB, Han YC, Takahara A
Journal of Vacuum Science & Technology B, 27(4), 1958, 2009