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A first-principles study of B3O3 monolayer as potential anode materials for calcium-ion batteries Mustafa M. Kadhim, Ali Majdi, Safa K. Hachim, Sallalh. Ahmed Abdullaha, Taleeb Zedan Taban, Ahmed Mahdi Rheima Korean Journal of Chemical Engineering, 40(7), 1633, 2023 |
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Impact of surface adsorbed gases on hydrogen diffusion into Pd(100) subsurface from first principles Liang TS, Kang HF, Zhong W, Bian HT, Zhao J Applied Surface Science, 473, 476, 2019 |
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Interface analysis of TiN/n-GaN Ohmic contacts with high thermal stability Zhu YF, Huang R, Li ZC, Hao H, An YX, Liu T, Zhao YF, Shen Y, Guo Y, Li FS, Ding SN Applied Surface Science, 481, 1148, 2019 |
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A strategy for increasing the energy release rate of aluminum by replacing the alumina passivation shell with aluminum iodate hexahydrate (AIH) Kalman J, Smith DK, Miller KK, Bhattacharia SK, Bratton KR, Pantoya ML Combustion and Flame, 205, 327, 2019 |
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Elucidating Li-ion adsorption and diffusion behavior on the surface of Cu0.7Co2.3O4 and improvement of performance as flexible full solid-state supercapacitor Liu QP, Wan J, Li YR, Ye HY, Han XY, Lai MH, He XY, Gu X, Hu CG Electrochimica Acta, 293, 380, 2019 |
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Reduced metal contamination from crucible and coating using a silicon nitride based diffusion barrier for the growth of cast quasi-single crystalline silicon ingots Wolny F, Krause A, Muller M, Fischer G, Neuhaus H Journal of Crystal Growth, 514, 49, 2019 |
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Enhanced thermal stability by introducing TiN diffusion barrier layer between W and SiC Cheng P, DelaCruz S, Tsai DS, Wang ZT, Carraro C, Maboudian R Journal of the American Ceramic Society, 102(9), 5613, 2019 |
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A reaction rate model for pyrite oxidation considering the influence of water content and temperature Wang H, Dowd PA, Xu CS Minerals Engineering, 134, 345, 2019 |
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TiN diffusion barrier for stable W/SiC(0001) interfaces in inert ambient at high temperature DelaCruz S, Wang ZT, Cheng P, Carraro C, Maboudian R Thin Solid Films, 670, 54, 2019 |
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Atomic layer deposition of WNx thin films using a F-free tungsten metal-organic precursor and NH3 plasma as a Cu-diffusion barrier Kim JB, Nandi DK, Kim TH, Jang Y, Bae JS, Hong TE, Kim SH Thin Solid Films, 685, 393, 2019 |