화학공학소재연구정보센터
검색결과 : 6건
No. Article
1 The effects of stress state, loading frequency and cyclic waveforms on the fatigue behavior of silver-filled electronically-conductive adhesive joints
Gomatam RR, Sancaktar E
Journal of Adhesion Science and Technology, 20(1), 53, 2006
2 A. novel cumulative fatigue damage model for electronically-conductive adhesive joints under variable loading
Gomatam RR, Sancaktar E
Journal of Adhesion Science and Technology, 20(1), 69, 2006
3 Effects of various adherend surface treatments on fatigue behavior of joints bonded with a silver-filled electronically conductive adhesive
Gomatam RR, Sancaktar E
Journal of Adhesion Science and Technology, 19(8), 659, 2005
4 Dynamic fatigue and failure behavior of silver-filled electronically conductive adhesive joints at ambient environmental conditions
Gomatam RR, Sancaktar E
Journal of Adhesion Science and Technology, 18(7), 731, 2004
5 Fatigue and failure behavior of silver-filled electronically-conductive adhesive joints subjected to elevated temperatures
Gomatam RR, Sancaktar E
Journal of Adhesion Science and Technology, 18(8), 849, 2004
6 Fatigue and failure behaviors of silver-filled electronically-conductive adhesive joints subjected to elevated humidity
Gomatam RR, Sancaktar E
Journal of Adhesion Science and Technology, 18(15-16), 1833, 2004